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(若只采購一條型號(hào),填寫一行即可)| *型號(hào) | *數(shù)量 | 廠商 | 批號(hào) | 封裝 |
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| 型號(hào): | S71WS512ND0BFWY33 |
| 廠商: | Spansion Inc. |
| 英文描述: | Stacked Multi-Chip Product (MCP) |
| 中文描述: | 堆疊式多芯片產(chǎn)品(MCP) |
| 文件頁數(shù): | 158/188頁 |
| 文件大?。?/td> | 2252K |
| 代理商: | S71WS512ND0BFWY33 |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S71WS512ND0BFWY60 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY62 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY63 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY70 | Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY72 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS512ND0BFWY60 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY62 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY63 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512ND0BFWY72 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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