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參數(shù)資料
| 型號： | S71NS064NB0BJWVT2 |
| 廠商： | Spansion Inc. |
| 英文描述： | MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst-mode Multiplexed Flash Memory |
| 中文描述： | 1.8伏的MirrorBit只同步讀/寫，突發(fā)模式復(fù)用閃存 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 261K |
| 代理商： | S71NS064NB0BJWVT2 |
8
S71NS-N MCP Products
S71NS-N_00_A3 October 10, 2006
A d v a n c e I n f o r m a t i o n
4.3
Physical Dimensions
4.3.1
NLB056—9.2 x 8.0 mm, 56-ball V FBGA
Figure 4.4 Physical Dimensions, NLB056—56-ball VFBGA
3507\ 16-038.22 \ 7.14.5
PACKAGE
NLB 056
JEDEC
N/A
D x E
9.20 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
0.20
---
---
BALL HEIGHT
A2
0.85
---
0.97
BODY THICKNESS
D
9.20 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
4.50 BSC.
MATRIX FOOTPRINT
E1
6.50 BSC.
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
14
MATRIX SIZE E DIRECTION
n
56
BALL COUNT
b
0.25
0.30
0.35
BALL DIAMETER
eE
0.50 BSC.
BALL PITCH
eD
0.50 BSC
BALL PITCH
SD / SE
0.25 BSC.
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
J1 ~ J14, K2 ~ K13
G1,G2,G13,G14,H1,H2,H5,H6,H9,H10,H13,H14
D1,D2,C1,CA2 ~ A13,B1 ~ B14
0.20
0.08
C
SIDE VIEW
A1
A
A2
6
56X
0.15
0.08
M
M C
A
C
B
b
C
C
BOTTOM VIEW
7
SE
E1
D1
eD
A
B
C
D
E
F
H G
J
K
14
13
12
8
7
6
5
4
3
9
10
11
2
1
eE
CORNER
PIN A1
7
SD
A
D
E
(2X)
0.10
C
C
B
(2X)
0.10
9
TOP VIEW
CORNER
PIN A1
INDEX MARK
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71NS064NB0BJWVT3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst-mode Multiplexed Flash Memory |
| S71NS064NC0BJWRN0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst-mode Multiplexed Flash Memory |
| S71NS064NC0BJWRN2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst-mode Multiplexed Flash Memory |
| S71NS064NC0BJWRN3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst-mode Multiplexed Flash Memory |
| S71NS064NC0BJWRT0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst-mode Multiplexed Flash Memory |
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