參數(shù)資料
型號(hào)： S71AL016D02BAWTF2
廠商： SPANSION LLC
元件分類： 存儲(chǔ)器
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA56
封裝： 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁數(shù)： 3/76頁
文件大小： 909K
代理商： S71AL016D02BAWTF2
November 11, 2004 S71AL016D_02_04_00_A1
3
A d v a n c e I n f o r m a t i o n
TABLE OF CONTENTS
S71AL016D based MCPs
Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 1
MCP Features ........................................................................................................ 1
General Description . . . . . . . . . . . . . . . . . . . . . . . . 1
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .2
16 Mb Flash Memory .............................................................................................2
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . .6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .8
Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . .9
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 10
TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA)
9 x 7 mm Package ...............................................................................................10
S29AL016D
General Description 12
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 1. S29AL016D Device Bus Operations .......................... 15
Word/Byte Configuration .................................................................................15
Requirements for Reading Array Data ..........................................................15
Writing Commands/Command Sequences .................................................16
Program and Erase Operation Status ...........................................................16
Standby Mode .......................................................................................................16
Automatic Sleep Mode .......................................................................................17
RESET#: Hardware Reset Pin ..........................................................................17
Output Disable Mode .........................................................................................17
Table 2. Sector Address Tables (Top Boot Device) ................. 18
Table 3. Sector Address Tables (Bottom Boot Device) ............ 19
Autoselect Mode ................................................................................................20
Table 4. S29AL016D Autoselect Codes (High Voltage Method) . 20
Sector Protection/Unprotection ...................................................................20
Temporary Sector Unprotect .........................................................................21
Figure 1. Temporary Sector Unprotect Operation.................... 21
Figure 2. In-System Sector Protect/Unprotect Algorithms........ 22
Common Flash Memory Interface (CFI) . . . . . . .23
Table 5. CFI Query Identification String ................................ 23
Table 6. System Interface String ......................................... 24
Table 7. Device Geometry Definition .................................... 24
Table 8. Primary Vendor-Specific Extended Query ................. 25
Hardware Data Protection ..............................................................................25
Low V
CC
Write Inhibit ..................................................................................25
Write Pulse “Glitch” Protection ................................................................25
Logical Inhibit ..................................................................................................26
Power-Up Write Inhibit ...............................................................................26
Reading Array Data ............................................................................................27
Reset Command ..................................................................................................27
Autoselect Command Sequence ....................................................................27
Word/Byte Program Command Sequence ................................................28
Unlock Bypass Command Sequence ........................................................28
Figure 3. Program Operation................................................ 29
Chip Erase Command Sequence ...................................................................29
Sector Erase Command Sequence ................................................................30
Erase Suspend/Erase Resume Commands ....................................................31
Figure 4. Erase Operation.................................................... 32
Command Definitions ........................................................................................33
Table 9. S29AL016D Command Definitions ........................... 33
Write Operation Status . . . . . . . . . . . . . . . . . . . . 34
DQ7: Data# Polling ............................................................................................34
Figure 5. Data# Polling Algorithm........................................ 35
RY/BY#: Ready/Busy# ....................................................................................... 35
DQ6: Toggle Bit I ...............................................................................................36
DQ2: Toggle Bit II ..............................................................................................36
Reading Toggle Bits DQ6/DQ2 ..................................................................... 37
Figure 6. Toggle Bit Algorithm............................................. 38
DQ5: Exceeded Timing Limits ........................................................................38
DQ3: Sector Erase Timer ................................................................................39
Table 10. Write Operation Status ......................................... 39
Figure 7. Maximum Negative Overshoot Waveform ................ 40
Figure 8. Maximum Positive Overshoot Waveform.................. 40
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 9. I
CC1
Current vs. Time (Showing Active and
Automatic Sleep Currents).................................................. 42
Figure 10. Typical I
CC1
vs. Frequency................................... 43
Figure 11. Test Setup......................................................... 44
Table 11. Test Specifications ............................................... 44
Figure 12. Input Waveforms and Measurement Levels............ 45
Read Operations .................................................................................................46
Figure 13. Read Operations Timings..................................... 46
Hardware Reset (RESET#) ..............................................................................47
Figure 14. RESET# Timings................................................. 47
Word/Byte Configuration (BYTE#) ...........................................................48
Figure 15. BYTE# Timings for Read Operations...................... 48
Figure 16. BYTE# Timings for Write Operations ..................... 49
Erase/Program Operations ..............................................................................50
Figure 17. Program Operation Timings ................................. 51
Figure 18. Chip/Sector Erase Operation Timings .................... 52
Figure 19. Data# Polling Timings (During Embedded Algorithms)..
53
Figure 20. Toggle Bit Timings (During Embedded Algorithms).. 53
Figure 21. DQ2 vs. DQ6 for Erase and Erase Suspend Operations .
54
Figure 22. Temporary Sector Unprotect/Timing Diagram......... 54
Figure 23. Sector Protect/Unprotect Timing Diagram.............. 55
Figure 24. Alternate CE# Controlled Write Operation Timings.. 57
TSOP and BGA Pin Capacitance . . . . . . . . . . . . 58
2Mbit Type 1 SRAM
Common Features . . . . . . . . . . . . . . . . . . . . . . . . 59
Functional Description . . . . . . . . . . . . . . . . . . . . . 60
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
These parameters are verified in device
characterization and are not 100% tested. . . . . . 60
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 60
Operating Characteristics (Over Specified
Temperature Range) . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 1. Power Savings with Page Mode (WE# = V
IH
) ........... 62
Timing Test Conditions . . . . . . . . . . . . . . . . . . . . 62
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 2. Timing of Read Cycle (CE# = OE# = V
IL
, WE# = CE2=
V
IH
)................................................................................. 64
Figure 3. Timing Waveform of Read Cycle (WE# = V
IH
).......... 64
Figure 4. Timing Waveform of Write Cycle (WE# Control) ....... 65
Figure 5. Timing Waveform of Write Cycle (CE1# Control) ...... 65
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相關(guān)代理商/技術(shù)參數(shù)
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S71AL016D02BAWTF3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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S71AL016D02BFWBF0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BFWBF2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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