參數(shù)資料
型號： S70WS512N00BAWAA2
廠商： Spansion Inc.
英文描述： Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
中文描述： 同硅晶片堆疊多芯片產(chǎn)品（MCP）的512兆位（32兆× 16位）的CMOS 1.8伏，只有同時(shí)讀/寫，突發(fā)模式閃存
文件頁數(shù)： 13/93頁
文件大小： 846K
代理商： S70WS512N00BAWAA2
March 14, 2005 S70WS512N00_00_A0
S70WS512N00 Based MCPs
11
A d v a n c e I n f o r m a t i o n
5
Connection Diagrams/Physical Dimensions
This section contains the I/O designations and package specifications for the S70WS512N.
5.1
Special Handling Instructions for FBGA Packages
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning meth-
ods. The package and/or data integrity may be compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of time.
5.2
Connection Diagrams
5.2.1
Same-Die Stack Pinout
A7
A3
A2
DQ8
DQ14
RFU
RFU
F-ACC
WE#
A8
A11
C3
C4
C5
C6
C7
C8
A6
RFU
F-RST#
RFU
A19
A12
A15
D2
D3
D4
D5
D6
D7
D8
D9
A5
A18
F-RDY
A20
A9
A13
A21
E2
E3
E4
E5
E6
E7
E8
E9
A1
A4
A17
A10
A14
A22
F2
F3
F4
F7
F8
F9
V
SS
DQ1
A0
DQ6
RFU
A16
G3
G4
G2
G7
G8
G9
F1-CE#
DQ0
OE#
DQ9
DQ3
DQ4
DQ13
DQ15
RFU
H2
H3
H4
H5
H6
H7
H8
H9
DQ10
F-VCC
RFU
DQ12
DQ7
V
SS
J2
J3
J4
J5
J6
J7
J8
J9
DQ2
DQ11
RFU
DQ5
K3
K8
K4
K5
K6
K7
RFU
A23
F5
RFU
RFU
G5
F6
G6
RFU
CLK
F2-CE#
RFU
RFU
RFU
B3
B4
B5
B6
B7
B8
RFU
RFU
F-VCC
RFU
RFU
RFU
L3
L4
L5
L6
L7
L8
B2
B9
C9
C2
K2
K9
L9
L2
AVD#
RFU
RFU
RFU
RFU
F-WP#
RFU
RFU
A1
A10
M1
M10
DNU
DNU
DNU
DNU
1st Flash only
Shared
Flash Shared only
Legend
RAM only
2nd Flash only
RFU
(Reserved for
Future Use)
84-ball Fine-Pitch Ball Grid Array
Same-Die Stack Pinout (Top View, Balls Facing Down)
相關(guān)PDF資料
PDF描述
S70WS512N00BAWAA3 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB0 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB2 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB3 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BFWA20 Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S70WS512N00BAWAA3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BAWAB3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
S70WS512N00BFWA20 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*