- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄98070 > S3C1860XX-DK 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PDIP20 PDF資料下載
參數(shù)資料
| 型號(hào)： | S3C1860XX-DK |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PDIP20 |
| 封裝： | 0.300 INCH, DIP-20 |
| 文件頁(yè)數(shù)： | 64/95頁(yè) |
| 文件大?。?/td> | 339K |
| 代理商： | S3C1860XX-DK |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)當(dāng)前第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)
REMOTE CONTROL TX. APPLICATION NOTE
S3C1840/C1850/C1860/P1860
7-10
PROGRAMMING GUIDELINES
When programming S3C1840/C1850/C1860 microcontroller, please follow the guidelines presented in this
subsection.
PCB Artwork
For remote control applications, turning the I.R.LED on and off may cause variations in transmission current
ranging from a few hundred
A to a few hundred mA. This current variation generates overshoot and undershoot
noise on the power line, causing a system malfunction.
Remocon
Signal
VDD
To reduce noise and to stabilize the chip's operation, we recommend that the application designer reduce
overshooting of the I.R.LED drive current and design PCB for the remote controller as follows: (The noise level
should be limited to around 0.5 V
P-P, where VP-P is the peak-to-peak voltage)
— Oscillation circuit should be located as near as possible to the chip.
— PCB pattern for V
DD/VSS should be as wide and short as possible.
— I.R.LED drive TR and I.R.LED should be located as far as possible from the chip.
— Power supply battery and power capacitor should be located as near as possible to the chip.
— The ground pattern of the TEST pin (Ground of I.R.LED drive TR) and V
SS pin should be separated and
connected directly with the battery terminal.
— The ceramic capacitor (0.1uF or 0.01uF) and power capacitor(over 47uF) is recommended to use noise filter.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S3P7048-QZ | 4-BIT, OTPROM, 6 MHz, MICROCONTROLLER, PQFP42 |
| S3P72B9-QA | 4-BIT, OTPROM, 6 MHz, MICROCONTROLLER, PQFP128 |
| S3C72B5XX-QA | 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PQFP128 |
| S3P72G9XX-QX | 4-BIT, OTPROM, 4.19 MHz, MICROCONTROLLER, PQFP100 |
| S3P72N8-QW | 4-BIT, OTPROM, 6 MHz, MICROCONTROLLER, PQFP80 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S3C2400 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:RISC MICROPROCESSOR |
| S3C2410A | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32-Bit RISC Microprocessor |
| S3C2410A-20 | 制造商:Samsung Electro-Mechanics 功能描述:Microprocessor, 32 Bit, 272 Pin, Plastic, BGA |
| S3C2410A20-YO80 | 制造商:Samsung Semiconductor 功能描述: 制造商:Samsung Semiconductor 功能描述:200MHz, MMU, NAND Flash Boot Loader, ROM/SRAM/SDRAM Control, STN/TFT LCD Control, Touch Panel Control, MMC/SD Card, USB, 10bit ADC/Lead Free |
| S3C2410A20-YOR0 | 制造商:Samsung Electro-Mechanics 功能描述:Microprocessor, 32 Bit, 272 Pin, Plastic, BGA |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。