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參數(shù)資料
| 型號： | S30RSK |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Center Tap Chip Resistor |
| 中文描述： | 中心抽頭貼片電阻 |
| 文件頁數(shù)： | 2/3頁 |
| 文件大小： | 257K |
| 代理商： | S30RSK |
Document Number: 60073
Revision 01-May-03
www.vishay.com
166
S30R / A30R, S30V / A30V
Vishay Thin Film
H
VISHAY THIN FILM FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: +49 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
ITALY + 39.2.300.11919 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988
SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 UK +44 191 514 8237 FAX: +44 1953 457 722 USA: (610) 407-4800 FAX: (610) 640-9081
SUBSTRATE
ALUMINA
1
SILICON
Thickness (Mils)
10
±
2
14
±
2
Isolation Layer
None
SiO
2
(10,000 Min.)
Metallization
Gold (15,000 )
Gold (15,000 )
Die Size (X)
30 x 30
±
3 MIL
30 x 30
±
3 MIL
Terminations
4 Mils Square Min.
4 Mils Square Min.
Packaging Standard 2" Square Waffle Pack (400 Max. per Package)
DIMENSIONS
1
Alumina has the benefit of the higher thermal conductivity
and superior high frequency characteristics,however the
resistance range is limited by the poorer line resolution
versus silicon, because of the surface finish.
Visual Criteria
MIL-STD-833 Method 2032 Class H
Thermal Shock (MIL-STD-202, Method 107, Test Condition C)
0.05% Max.
R/R (0.02% Typical)
High Temperature Exposure (125
°
C, 100 Hours in Air)
0.10% Max.
R/R (0.07% Typical)
Low Temperature Operation (MIL-PRF-55342 Paragraph 4.7.4)
0.05% Max.
R/R (0.025% Typical)
Moisture Resistance (MIL-STD-202 Method 106)
0.25% Max.
R/R (0.05% Typical)
Short Time Overload (5 x Rated Power 25
°
C, 5 sec.)
0.25% Max.
R/R (0.05% Typical)
Resistance Ratio Accuracy
±
2% Standard or
±
0.1 ohm whichever is greater (0.05% available)
Resistive Element
Tamelox
Termination Pads
Gold
Substrate Material
Silicon or Alumina
T
X
X
Center Tap Chip Resistor
MECHANICAL SPECIFICATIONS
FULL LOT TRACEABILITY TO WAFER LEVEL
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