參數(shù)資料
型號: S29GL032M10TAIR42
廠商: SPANSION LLC
元件分類: PROM
英文描述: CAP .1UF 1000V CER 10% X7R RADL
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PDSO48
封裝: MO-142-EC, TSOP-48
文件頁數(shù): 59/160頁
文件大?。?/td> 4727K
代理商: S29GL032M10TAIR42
April 30, 2004 S29GLxxxM_00A5
S29GLxxxM MirrorBitTM Flash Family
151
Pre l i m i n a r y
Physical Dimensions
LAC064—64-Pin 18 x 12 mm package
3243 \ 16-038.12d
PACKAGE
LAC 064
JEDEC
N/A
18.00 mm x 12.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
1.40
PROFILE HEIGHT
A1
0.40
---
STANDOFF
A2
0.60
---
BODY THICKNESS
D
18.00 BSC.
BODY SIZE
E
12.00 BSC.
BODY SIZE
D1
7.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
8
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
64
BALL COUNT
φb
0.50
0.60
0.70
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD / SE
0.50 BSC.
SOLDER BALL PLACEMENT
NONE
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
BOTTOM VIEW
SIDE VIEW
TOP VIEW
2X
C
0.20
C
0.20
6
7
A
M
M C
C
φ 0.10
φ 0.25
B
C
0.25
0.15 C
A
B
C
SEATING PLANE
eD
(INK OR LASER)
CORNER
A1
A2
D
E
φ0.50
A1 CORNER ID.
1.00±0.5
A
A1
CORNER
A1
NX
φb
SD
SE
eE
E1
D1
1
2
3
4
5
6
7
8
A
CB
D
FE
G
H
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