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    參數(shù)資料
    型號: S29GL032M10BCIR33
    廠商: SPANSION LLC
    元件分類: PROM
    英文描述: Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; ESR: 40m&Omega;; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-31; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 2.8mm; Temperature Range: -55C to +125C; Container: Tape &amp; Reel; Qty per Container: 500; Features: Low Temperature
    中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
    封裝: LEAD FREE, BGA-48
    文件頁數(shù): 54/162頁
    文件大?。?/td> 4557K
    代理商: S29GL032M10BCIR33
    March 30, 2004 S29GLxxxM_00A4
    S29GLxxxM MirrorBitTM Flash Family
    147
    Pre l i m i n a r y
    Physical Dimensions
    TSR040—40-Pin Standard/Reverse Thin Small Outline Package (TSOP)
    -X-
    X = A OR B
    e/2
    DETAIL B
    c
    L
    0.25MM (0.0098") BSC
    0
    DETAIL A
    R
    GAGE LINE
    PARALLEL TO
    SEATING PLANE
    b
    b1
    (c)
    7
    6
    c1
    WITH PLATING
    BASE METAL
    7
    C A-B S
    M
    0.08MM (0.0031")
    SECTION B-B
    e
    0.10 C
    A2
    PLANE
    SEATING
    C
    A1
    SEE DETAIL B
    B
    SEE DETAIL A
    2
    REVERSE PIN OUT (TOP VIEW)
    2
    N
    +1
    N
    1
    4
    3
    A
    -A-
    -B-
    5
    9
    E
    5
    D1
    D
    6
    2
    3
    4
    5
    7
    8
    9
    TSR 040
    MO-142 (B) EC
    40
    MIN
    0.05
    0.95
    0.17
    0.10
    18.30
    19.80
    0.50
    0
    0.08
    9.90
    0.50 BASIC
    MAX
    0.15
    1.20
    0.27
    0.16
    0.21
    5
    0.20
    18.50
    10.10
    0.70
    20.20
    0.23
    1.05
    0.20
    1.00
    0.22
    18.40
    20.00
    0.60
    3
    10.00
    NOM
    Symbol
    Jedec
    Package
    b1
    A2
    A1
    A
    D
    L
    e
    E
    D1
    b
    c1
    c
    0
    R
    N
    1
    NOTES:
    CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
    (DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
    NOT APPLICABLE.
    PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
    TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
    CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
    HORIZONTAL SURFACE.
    DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
    0.15MM (.0059") PER SIDE.
    DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
    0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
    BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
    THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
    0.25MM (0.0098") FROM THE LEAD TIP.
    LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
    DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
    3324 \ 16-038.10a
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