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參數(shù)資料
| 型號： | S29CL032J0PFAM020 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| 封裝： | 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80 |
| 文件頁數(shù)： | 5/79頁 |
| 文件大?。?/td> | 2994K |
| 代理商： | S29CL032J0PFAM020 |
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March 30, 2009 S29CD-J_CL-J_00_B3
S29CD-J & S29CL-J Flash Family
13
Data
She e t
5.2
PQR080–80-Lead Plastic Quad Flat Package Physical Dimensions
3213\38.4C
PACKAGE
PQR 080
JEDEC
MO-108(B)CB-1
NOTES
SYMBOL
MIN
NOM
MAX
A
--
3.35
A1
0.25
--
A2
2.70
2.80
2.90
b
0.30
--
0.45
SEE NOTE 4
c
0.15
--
0.23
D
17.00
17.20
17.40
D1
13.90
14.00
14.10
SEE NOTE 3
D3
--
12.0
--
REFERENCE
e
--
0.80
--
BASIC, SEE NOTE 7
E
23.00
23.20
23.40
E1
19.90
20.00
20.10
SEE NOTE 3
E3
--
18.40
--
REFERENCE
aaa
---
0.20
---
ccc
0.10
L
0.73
0.88
1.03
P24
Q40
R64
S80
NOTES:
1.
ALL DIMENSIONS AND TOLERANCES CONFORM TO
ANSI Y14.5M-1982.
2.
DATUM PLANE -A- IS LOCATED AT THE MOLD PARTING LINE
AND IS COINCIDENT WITH THE BOTTOM OF THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY.
3.
DIMENSIONS "D1" AND "E1" DO NOT INCLUD MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 mm PER SIDE.
DIMENSIONS "D1" AND "E1" INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE -A-
4.
DIMENSION "B" DOES NOT INCLUDE DAMBAR PROTRUSION.
5.
CONTROLLING DIMENSIONS: MILLIMETER.
6.
DIMENSIONS "D" AND "E" ARE MEASURED FROM BOTH
INNERMOST AND OUTERMOST POINTS.
7.
DEVIATION FROM LEAD-TIP TRUE POSITION SHALL BE WITHIN
±0.0076 mm FOR PITCH > 0.5 mm AND WITHIN ±0.04 FOR
PITCH < 0.5 mm.
8.
LEAD COPLANARITY SHALL BE WITHIN: (REFER TO 06-500)
1 - 0.10 mm FOR DEVICES WITH LEAD PITCH OF 0.65 - 0.80 mm
2 - 0.076 mm FOR DEVICES WITH LEAD PITCH OF 0.50 mm.
COPLANARITY IS MEASURED PER SPECIFICATION 06-500.
9.
HALF SPAN (CENTER OF PACKAGE TO LEAD TIP) SHALL BE
WITHIN ±0.0085".
b
c
SECTION S-S
6
3
6
-B-
PIN R
PIN S
-A-
PIN ONE I.D.
D1
D
D3
PIN Q
-D-
PIN P
E
E1
E3
SEE NOTE 3
A
A1
A2
-C-
-A-
SEATING PLANE
2
e BASIC
SEE DETAIL X
S
DETAIL X
0.25
A
C
ccc
SD S
4
C AB
M
a
b
0-7
a
0MIN.
L
GAGE
PLANE
7
TYP.
0.30 ± 0.05 R
7
TYP.
0.20 MIN. FLAT SHOULDER
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