參數(shù)資料
型號(hào)： S29CD016J1MFFM002
廠商： Spansion Inc.
英文描述： 32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O
中文描述： 32/16兆位的CMOS 2.6伏或3.3伏，只有同時(shí)讀/寫(xiě)，雙啟動(dòng)，突發(fā)模式閃存記憶體與VersatileI /輸出
文件頁(yè)數(shù)： 14/76頁(yè)
文件大小： 1245K
代理商： S29CD016J1MFFM002
12
S29CD-J & S29CL-J Flash Family
S29CD-J_CL-J_00_B1 September27,2006
D a t a
S h e e t
( P r e l i m i n a r y )
5.5
LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm) Physical Dimensions
3214\38.12C
PACKAGE
LAA 080
JEDEC
N/A
13.00 x 11.00 mm
PACKAGE
NOTE
SYMBOL
MIN
NOM
MAX
A
--
--
1.40
PROFILE HEIGHT
A1
0.40
--
--
STANDOFF
A2
0.60
--
--
BODY THICKNESS
D
13.00 BSC.
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
9.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
φ
b
eD
80
BALL COUNT
0.50
0.60
0.70
BALL DIAMETER
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD/SE
0.50 BSC
SOLDER BALL PLACEMENT
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX
SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF
SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW , SD OR SE = e/2
8.
N/A
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
BOTTOM VIEW
SIDE VIEW
TOP VIEW
2X
2X
C
0.20
C
0.20
6
7
7
A
C
C
φ
0.10
φ
0.25 M
M
B
C
0.25
0.15 C
A
B
C
SEATING PLANE
J
K
eD
(INK OR LASER)
CORNER
A1
A2
D
E
φ
05
A1 CORNER ID.
1.00±0.5
1
A
A1
CORNER
A1
NX
φ
b
SD
SE
eE
E1
D1
1
2
3
4
5
6
7
8
A
C
B
D
F
E
G
H
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29CD016J1MFFM003 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O
S29CD016J1MFFM033 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O
S29CD016J1MFFM100 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O
S29CD016J1MFFM102 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O
S29CD016J1MFFM103 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O
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