
February 18, 2005 S29AL004D_00_A1
S29AL004D
3
A d v a n c e  I n f o r m a t i o n
General Description
The S29AL004D is a 4 Mbit, 3.0 volt-only Flash memory organized as 524,288 
bytes or 262,144 words. The device is offered in 48-ball FBGA, 44-pin SO, and 
48-pin TSOP packages. The word-wide data (x16) appears on DQ15–DQ0; the 
byte-wide (x8) data appears on DQ7–DQ0. This device requires only a single, 3.0 
volt V
CC
 supply to perform read, program, and erase operations. A standard 
EPROM programmer can also be used to program and erase the device. 
This device is manufactured using Spansion’s 200nm process technology, and of-
fers all the features and benefits of the Am29LV400B and MBM29LV400T/BC, 
which were manufactured using 320nm process technology.
The standard device offers access times of 70 and 90ns, allowing high speed mi-
croprocessors to operate without wait states. To eliminate bus contention the 
device has separate chip enable (CE#), write enable (WE#) and output enable 
(OE#) controls.
The device requires only a 
single 3.0 volt power supply
 for both read and write 
functions. Internally generated and regulated voltages are provided for the pro-
gram and erase operations. 
The device is entirely command set compatible with the 
JEDEC single-power-
supply Flash standard
. Commands are written to the command register using 
standard microprocessor write timings. Register contents serve as input to an in-
ternal state-machine that controls the erase and programming circuitry. Write 
cycles also internally latch addresses and data needed for the programming and 
erase operations. Reading data out of the device is similar to reading from other 
Flash or EPROM devices.
Device programming occurs by executing the program command sequence. This 
initiates the 
Embedded Program
 algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies proper cell margin. The 
Unlock Bypass
 mode facilitates faster programming times by requiring only two 
write cycles to program data instead of four.
Device erasure occurs by executing the erase command sequence. This initiates 
the 
Embedded Erase
 algorithm—an internal algorithm that automatically 
preprograms the array (if it is not already programmed) before executing the 
erase operation. During erase, the device automatically times the erase pulse 
widths and verifies proper cell margin. 
The host system can detect whether a program or erase operation is complete by 
observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (tog-
gle) 
status bits
. After a program or erase cycle is completed, the device is ready 
to read array data or accept another command. 
The 
sector erase architecture
 allows memory sectors to be erased and repro-
grammed without affecting the data contents of other sectors. The device is fully 
erased when shipped from the factory.
Hardware data protection
 measures include a low V
CC
 detector that automat-
ically inhibits write operations during power transitions. The 
hardware sector 
protection
 feature disables both program and erase operations in any combina-
tion of the sectors of memory. This can be achieved in-system or via 
programming equipment.