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參數(shù)資料
| 型號： | S2078 |
| 廠商： | Applied Micro Circuits Corp. |
| 英文描述： | Dual Fibre Channel Transceiver(雙光纖通道收發(fā)器) |
| 中文描述： | 雙光纖通道收發(fā)器（雙光纖通道收發(fā)器） |
| 文件頁數(shù)： | 5/8頁 |
| 文件大?。?/td> | 111K |
| 代理商： | S2078 |
5
S2078 Application Note and Reference
Diagrams
APPLICATION NOTE
Revision 1.0 - February 25, 2000
Layout Recommendations
Figures 5 and 6 show a sample layout from top and bottom view.
Figure 5 is a top view, showing each ball landing pad with an associated via. The vias are offset from the balls and
exploded outward with respect to the center of the part. Offsetting the vias from the ball pad insures that solder
from the ball is not wicked down into the via during the soldering process. The vias are exploded outward in order
to maximize the current paths through the via field into the area under the center of the chip.
Figure 6 shows the view from the bottom of the board with the chip outline superimposed. This provides an illus-
tration of the wide corridors through the vias that allow current to flow into the area under the center of the chip
(one corridor on the center of each side). This sample layout shows all decoupling, loop filter, and high-speed I/O
components on the back side of the board.
Figure 5. S2062 Sample Layout (Top View)
Top View
HS I/O via
Analog Power via
Loop Filter via
Ball Pad
Via
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
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