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參數(shù)資料
| 型號(hào)： | RMPA1850 |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 衰減器 |
| 英文描述： | Quad Band GSM/GPRS Power Amplifier Module |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 7 X 10 MM, 1.60 MM HEIGHT, MODULE-12 |
| 文件頁數(shù)： | 8/9頁 |
| 文件大?。?/td> | 120K |
| 代理商： | RMPA1850 |
8
www.fairchildsemi.com
RMPA1850 Rev. A1
R
fi
e
Application Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE
Precautions to Avoid Permanent Device Damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. Devices should remain in their orig-
inal packaging until component placement to ensure no con-
tamination or damage to RF, DC & ground contact areas.
Device Cleaning: Standard board cleaning techniques should
not present device problems provided that the boards are
properly dried to remove solvents or water residues.
Static Sensitivity: Follow ESD precautions to protect against
ESD damage:
A properly grounded static-dissipative surface on which to
place devices.
Static-dissipative
fl
oor or mat.
A properly grounded conductive wrist strap for each per-
son to wear while handling devices.
General Handling: Handle the package on the top with a vac-
uum collet or along the edges with a sharp pair of bent twee-
zers. Avoiding damaging the RF, DC, & ground contacts on
the package bottom. Do not apply excessive pressure to the
top of the lid.
Device Storage: Devices are supplied in heat-sealed, mois-
ture-barrier bags. In this condition, devices are protected and
require no special storage conditions. Once the sealed bag
has been opened, devices should be stored in a dry nitrogen
environment.
Device Usage:
Fairchild RF recommends the following procedures prior to
assembly.
Dry-bake devices at 125
°
C for 24 hours minimum. Note: The
shipping trays cannot withstand 125
°
C baking temperature
Assemble the dry-baked devices within 7 days of removal
from the oven.
During the 7-day period, the devices must be stored in an
environment of less than 60% relative humidity and a
maximum temperature of 30
°
C
If the 7-day period or the environmental conditions have
been exceeded, then the dry-bake procedure must be
repeated.
Solder Materials & Temperature Pro
fi
le:
Re
fl
ow soldering is the preferred method of SMT attachment.
Hand soldering is not recommended.
–
Re
fl
ow Pro
fi
le
Ramp-up: During this stage the solvents are evapo-
rated from the solder paste. Care should be taken to
prevent rapid oxidation (or paste slump) and solder
bursts caused by violent solvent out-gassing. A typical
heating rate is 1- 2
°
C/sec.
Pre-heat/soak: The soak temperature stage serves two
purposes; the
fl
ux is activated and the board and
devices achieve a uniform temperature. The recom-
mended soak condition is: 120-150 seconds at 150
°
C.
Re
fl
ow Zone: If the temperature is too high, then
devices may be damaged by mechanical stress due to
thermal mismatch or there may be problems due to
excessive solder oxidation. Excessive time at tempera-
ture can enhance the formation of inter-metallic com-
pounds at the lead/board interface and may lead to
early mechanical failure of the joint. Re
fl
ow must occur
prior to the
fl
ux being completely driven off. The dura-
tion of peak re
fl
ow temperature should not exceed 10
seconds. Maximum soldering temperatures should be
in the range 215-220
°
C, with a maximum limit of 225
°
C.
Cooling Zone: Steep thermal gradients may give rise to
excessive thermal shock. However, rapid cooling promotes a
fi
ner grain structure and a more crack-resistant solder joint.
The illustration below indicates the recommended soldering
pro
fi
le.
Solder Joint Characteristics: Proper operation of this device
depends on a reliable void-free attachment of the heatsink to
the PWB. The solder joint should be 95% void-free and be a
consistent thickness.
Rework Considerations: Rework of a device attached to a
board is limited to re
fl
ow of the solder with a heat gun. The
device should not be subjected to more than 225
°
C and
re
fl
ow solder in the molten state for more than 5 seconds. No
more than 2 rework operations should be performed.
Recommended Solder Re
fl
ow Pro
fi
le
0
20
40
60
80
100
120
140
DEG (
°
C)
TIME (SEC)
10 SEC
183
°
C
1
°
C/SEC
1
°
C/SEC
SOAK AT 150
°
C
FOR 60 SEC
45 SEC (MAX)
ABOVE 183
°
C
160
180
200
220
240
0
60
120
180
240
300
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