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參數(shù)資料
| 型號(hào)： | RM805-17 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | LEAD FREE A6841 SOIC-20 |
| 中文描述： | 功率放大器模塊，寬帶 |
| 文件頁(yè)數(shù)： | 7/10頁(yè) |
| 文件大?。?/td> | 226K |
| 代理商： | RM805-17 |
RM805
Package and Handling Information
Power Amplifier Module for Broadband
101505D
December 6, 2002
Skyworks Solutions, Inc., Proprietary
7
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The RM805 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Skyworks, please refer to
Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752
. Additional information on standard SMT reflow profiles
can also be found in the
JEDEC Standard J–STD–020A
.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to
Application Note: Tape and Reel, Document Number 101568.
Figure 4. Typical Case Markings
101505_008
CONEXANT
RM805-NN
EXXXXX.XX
YYWW MEX
Manufacturing
Part Number-Revision Number
Mark Pin 1
Identifier
Lot Number
YY = Manufacture Year
WW = Week Package
Sealed
MEX = Country Code
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