參數(shù)資料
型號(hào)： RLS664-812GG
廠商： ADVANCED INTERCONNECTIONS CORP
元件分類： 插座
英文描述： DIP64, IC SOCKET
封裝： ROHS COMPLIANT
文件頁(yè)數(shù)： 2/2頁(yè)
文件大小： 191K
代理商： RLS664-812GG
Molded DIP Sockets
Closed Frame and Open Frame
DIP Sockets
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
22
.400
(10.16)
.400
(10.16)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.900
(22.86)
.500
(12.70)
.500
(12.70)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
1.000
(25.40)
1.100
(27.54)
1.200
(30.48)
1.200
(30.48)
1.400
(35.56)
1.600
(40.64)
2.000
(50.80)
2.400
(60.96)
3.200
(81.28)
24
24
28
32
40
48*
64*
8
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.700
(17.78)
.800
(20.32)
.900
(22.86)
1.000
(25.40)
1.100
(27.94)
1.200
(30.48)
1.400
(35.56)
14
16
18
20
22
24
28
15
.165
(4.19)
.275
(6.99)
.020 Dia.
(.51)
Type -237
Standard Quick-Turn Terminals
Type -01
Low Profile Solder Tail
Type -29
Type -30
Type -51
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.130
(3.30)
.110
(2.79)
.020 Dia.
(.51)
Low Profile Solder Tail
Low Profile Solder Tail
Low Profile Solder Tail
Type -04
Super Low Profile
Not for use with Closed Frame
Type -49
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.095
(2.41)
.095
(2.41)
.028 Dia.
(.71)
Solder Preform Terminals
Tin/Lead:Type -150
Lead-free:Type -811
.072 Dia.
(1.83)
.020 Dia.
(.51)
(2.79)
(3.30)
Solder
.072 Dia.
(1.83)
(4.19)
(3.18)
.020 Dia.
(.51)
Solder
Tin/Lead:Type -151
Lead-free:Type -812
.052 Dia.
(1.32)
.155
(3.94)
Dimensional Information
B
C
A
.125
(3.18)
C
A
.050*
(1.27)
B
Closed Frame
Open Frame
# of Pins
A
B
C
Intrusive Reflow Application:
Combines the labor of socket
loading and solder application into
one operation.
Eliminates the use of solder paste
and screening operation.
Eliminates solder bridges and/or
solder shorts due to excess
solder.
Ensures a reliable solder joint with
controlled solder volume.
Ideal for surface mount and mixed
technology applications.
For custom solder preform
terminal applications consult
factory.
# of Pins
A
B
C
The dimensions in
blue
are for Open Frame only.
*Socket body thickness is .100/(2.54) for 48 and 64 positions.
Ultra Low Profile
Not for use with Closed Frame
Surface Mount
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Available Online:
RoHS Qualification Test Report
PC Board
Preform After
Solder Preform
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