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參數(shù)資料
| 型號： | RLS664-812GG |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | DIP64, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 191K |
| 代理商： | RLS664-812GG |
DIP Sockets
Molded DIP Sockets
Closed Frame and Open Frame
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
14
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Table of Models
Description:
Closed Frame (RDS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Description:
Open Frame (RLS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.050
(1.27)
.125
(3.18)
How To Order
RDS 3 16 - 01 M G
Contact Plating
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Body Type
RoHS Compliant:
RDS - New Hi-Temp
Closed Frame Molded
RLS - New Hi-Temp
Open Frame Molded
Number of Pins
Closed Frame 8 - 40
Open Frame 8 - 64
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)*
*Open Frame only
Description:
Peel-A-Way
(KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
For more information, refer to the Peel-A-Way
DIP Sockets pages.
Polyimide
Film
.005
(.13)
RDS replaces DS and HDS.
RLS replaces LS and HLS.
Options
Tape Sealant - add 3M to end of part number
Removable tape seal protects plated contact in harsh environments
Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
Spray flux without contaminating contact area
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Features:
Multiple finger contact on all
sockets assures maximum
reliability.
Tapered entry for ease of insertion.
Closed bottom sleeve for 100%
anti-wicking of solder.
To fit .100/(2.54mm) pitch.
Easily customized to fit your
application.
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
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