參數(shù)資料
型號: RF2461
廠商: RF MICRO DEVICES INC
元件分類: 無繩電話/電話
英文描述: CDMA/FM LOW NOISE AMPLIFIER/MIXER 900MHZ DOWNCONVERTER
中文描述: TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC20
封裝: 4 X 4 MM, QFN-20
文件頁數(shù): 1/14頁
文件大?。?/td> 365K
代理商: RF2461
8-123
8
F
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
IF2+
15
IF2-
14
BYPASS
13
IF1+
12
IF1-
11
M
10
G
9
I
8
I
7
L
6
GND1B
5
VCC1
4
LNA IN
3
MIX GAIN
2
LNA GAIN
1
I
20
I
19
E
18
L
17
V
16
RF2461
CDMA/FM LOW NOISE AMPLIFIER/MIX ER
900 MHZ DOWNCONVER T ER
CDMA/FM Cellular Systems
Supports Dual-Mode AMPS/CDMA
Supports Dual-Mode TACS/JCDMA
General Purpose Downconverter
Commercial and Consumer Systems
Portable Battery-Powered Equipment
The RF2461 is a receiver front-end designed for the
receive section of dual-mode CDMA/FM cellular applica-
tions. It is designed to amplify and downconvert RF sig-
nals, while providing 30dB of stepped gain control range.
Features include digital control of LNA gain, mixer gain,
and power down mode. Another feature of the chip is
adjustable IIP3 of the LNA and mixer using an off-chip
current setting resistor. Noise figure, IP3, and other specs
are designed to be compatible with the IS-98B interim
standard for CDMA cellular communications. The IC is
manufactured on an advanced Silicon Germanium HBT
process and is in a 4mmx4mm, 20-pin, leadless chip car-
rier.
Complete Receiver Front-End
Stepped LNA/Mixer Gain Control
Adjustable LNA/Mixer Bias Current
Adjustable LNA/Mixer IIP3
Meets IMD Tests with Three Gain States/
Two Logic Control Lines
RF2461
CDMA/FM Low Noise Amplifier/Mixer 900MHz
Downconverter
Fully Assembled Evaluation Board
RF2461 PCBA
8
Rev A13 010607
1.00
0.90
4.00
sq.
0.60
0.24 typ
3
0.20
0.75
0.50
0.23
4 PLCS
0.50
2.10
sq.
0.65
4 PLCS
0.05
12°
MAX
Dimensions in mm.
Note orientation of package.
NOTES:
Shaded lead is Pin 1.
1
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
2
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
Package S tyle: LCC , 20-Pin, 4 x 4
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