3
REF02
Input Voltage......................................................................................+40V
Operating Temperature
G, P, U ...........................................................................–40
°
C to +85
°
C
Storage Temperature Range
G, P, U ........................................................................... –65
°
C to +125
°
M .................................................................................... –65
°
C to +150
°
Output Short Circuit Duration (to Ground or V
) ....................... Indefinite
Junction Temperature ....................................................... –65
°
C to +150
°
θ
JA
P ......................................................................................... 120
°
C/W
U ........................................................................................... 80
°
C/W
Lead Temperature (soldering, 60s) ............................................... +300
°
C
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATIONS
Top View
DIP/SOIC
NC
V
IN
Temp
GND
NC
NC
V
OUT
Trim
1
2
3
4
8
7
6
5
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PRODUCT
V
OUT
AT 25
°
C
5V
±
15mV
5V
±
10mV
5V
±
15mV
5V
±
10mV
(ppm/
°
C)
TEMPERATURE
PACKAGE
REF02AU
REF02BU
REF02AP
REF02BP
±
15
±
10
±
15
±
10
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
SOIC
SOIC
Plastic DIP
Plastic DIP
ORDERING INFORMATION
MAX DRIFT
PACKAGE INFORMATION
PACKAGE DRAWING
NUMBER
(1)
PRODUCT
PACKAGE
REF02AU
REF02BU
REF02AP
REF02BP
SOIC
SOIC
Plastic DIP
Plastic DIP
182
182
006
006
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.