
20
Data Device Corporation
www.ddc-web.com
RDC-19220 SERIES
N-09/03-0
20
Data Device Corporation
www.ddc-web.com
RDC-19220 SERIES
N-08/03-0
ORDERING INFORMATION
RDC-1922X - XXXX
(Ceramic Package)
Supplemental Process Requirements:
T = Tape and Reel (Not available in 40-pin DDIP package)
S = Pre-Cap Source Inspection
L = 100% Pull Test
Q = Pre-Cap Source and 100% Pull Test
K = One Lot Date Code
W = One Lot Date Code and Pre-Cap Source Inspection
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, Pre-Cap Source Inspection and 100% Pull Test
Blank = None of the Above
Accuracy:
3 = 2 minutes + 1 LSB
Process Requirements:
0 = Standard DDC Processing, without Burn-In
1 = MIL-PRF-38534 Compliant
2 = Standard DDC Processing, with Burn-In
3 = MIL-PRF-38534 Compliant, with PIND testing
4 = MIL-PRF-38534 Compliant, with Solder Dip
5 = MIL-PRF-38534 Compliant, with PIND testing, and Solder Dip
6 = Standard DDC Processing, with PIND testing, and Burn-In
7 = Standard DDC Processing, with Solder Dip, and Burn-In
9 = Standard DDC Processing, with Solder Dip, without Burn-In
Temperature Grade / Data Requirements:
1 = -55 to +125°C
4 = -55 to +125°C, with Variables Test Data
Package:
0 = 40-Pin DDIP, (“+5 volt only” power supply feature - not available)
2 = 44-Pin J-Lead
THIN-FILM RESISTOR NETWORKS: (Operating temperature range: -55 to +125°C)
DDC-49530 = 11.8 V input, DIP
DDC-57470 = 11.8 V input, surface mount
DDC-49590 = 90 V input, DIP
DDC-55688-1 = 2 V direct, DIP
DDC-73089 = 2 V differential, surface mount
DDC-57471 = 90 V input, surface mount
External Component Selection Software (refer to General Setup
Conditions section) can be downloaded from DDC’s web site:
www.ddc-web.com.
STANDARD DDC PROCESSING
TEST
MIL-STD-883
METHOD(S)
CONDITION(S)
INSPECTION
2009, 2010, 2017,and 2032
—
SEAL
1014
A and C
TEMPERATURE CYCLE
1010
C
CONSTANT ACCELERATION
2001
3000g
BURN-IN
1015, 1030*
Table 1
* When applicable