參數(shù)資料
型號(hào): RBO40-40M
廠商: 意法半導(dǎo)體
英文描述: REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
中文描述: REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
文件頁(yè)數(shù): 11/15頁(yè)
文件大?。?/td> 166K
代理商: RBO40-40M
SUBSTRATESAND MOUNTINGINFORMATION
The use of epoxyFR4 boardsis quite common for
surface mounting techniques,however, their poor
thermal conductioncompromisesthe
outstanding
thermal
PowerSO-10. Some methods to overcome this
limitationare discussedbelow.
One possibility to improve the thermal conduction
is the use of large heat spreader areas at the
copper layer of the PC board. This leads to a
reductionof thermal resistanceto 35
°
C for 6 cm
2
of theboard heatsink(seefig.2).
Use of copper-filledthroughholes on conventional
FR4 techniqueswill increase the metallization and
otherwise
of
performance
the
decrease thermal resistance accordingly. Using
a configurationwith 16holesunderthe spreaderof
the packagewith a pitchof 1.8 mm anda diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12
°
C/W (see fig. 3).
Besidethe thermaladvantage,thissolutionallows
multi-layer boards to be used. However, a
drawback of this traditional material prevents its
use in very high power, high current circuits. For
instance, it is not advisable to surface mount
devices with currents greater than 10 A on FR4
boards. A Power Mosfet or Schottky diode in a
surfacemount
power packagecan handleup to
around50 A ifbetter substratesare used.
Fig.2 :
Mountingon epoxyFR4head dissipationbyextendingthe area of thecopper layer
Fig. 3 :
Mountingon epoxyFR4 byusing copper-filledthroughholesfor heattransfer
FR4 board
Copper foil
FR4board
Copperfoil
heattransfer
heatsink
RBO40-40G / RBO40-40M / RBO40-40T
11/15
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