參數(shù)資料
型號(hào)： RBO40-40G
廠商： 意法半導(dǎo)體
英文描述： REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
中文描述： REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
文件頁(yè)數(shù)： 12/15頁(yè)
文件大?。?/td> 166K
代理商： RBO40-40G
PowerSo-10package mountedon
R
th
(j-a)
P Diss
1.FR4 using therecommendedpad-layout
50
°
C/W
1.5 W
2.FR4 withheatsinkon board(6cm
2
)
35
°
C/W
2.0 W
3.FR4 withcopper-filledthroughholes and externalheatsinkapplied
12
°
C/W
5.8 W
4. IMSfloating inair (40cm
2
)
8
°
C/W
8.8 W
5. IMSwith externalheatsinkapplied
3.5
°
C/W
20 W
TABLE1
A new technology available today is IMS - an
Insulated Metallic Substrate. This offers greatly
enhanced thermal characteristics for surface
mount components. IMS is a substrateconsisting
of threedifferentlayers,(I)thebasematerialwhich
is availableas an aluminium or a copper plate,(II)
a thermal conductive dielectrical layer and (III) a
copper foil, which can be etched as a circuitlayer.
Using this material a thermalresistance of 8
°
C/W
with 40 cm
2
of board floating in air is achievable
(seefig.4).If evenhigherpower isto be dissipated
an externalheatsink could be appliedwhich leads
to an R
th
(j-a) of 3.5
°
C/W (see Fig. 5), assuming
that
R
th
(heatsink-air)
(junction-heatsink). This is commonly applied in
practice,
leading
to
dimensions. Often power devices are defined by
is
equal
to
R
th
reasonable
heatsink
consideringthe maximum junction temperatureof
the device. In practice , however, this is far from
being exploited. A summary of various power
managementcapabilities is made in table1 based
on a reasonabledelta T of 70
°
Cjunctionto air.
The PowerSO-10 concept also represents an
attractive alternative to C.O.B. techniques.
PowerSO-10 offers devices fully tested at low
and high temperature. Mounting is simple - only
conventionalSMT is required - enabling the users
to getrid ofbond wireproblemsandtheproblemto
controlthe hightemperaturesoftsolderingaswell.
An optimized thermal managementis guaranteed
through PowerSO-10 as the power chips must in
any case be mounted on heat spreaders before
beingmountedonto the substrate.
Fig.4 :
Mountingon metalbackedboard
Fig. 5 :
Mounting on metal backed board with an
externalheatsinkapplied
FR4board
Copperfoil
Aluminium
heatsink
Copper foil
Insulation
Aluminium
RBO40-40G / RBO40-40M / RBO40-40T
12/15
相關(guān)PDF資料
PDF描述
RBO40-40M REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
RC-RSA-H-100-M ROD ACTUATOR. H100 AND CABLE
RC-RSA-H-200-M ROD ACTUATOR. H200 AND CABLE
RC-RSA-H-300-M ROD ACTUATOR. H300 AND CABLE
RC-RSA-L-100-M ROD ACTUATOR. L100 AND CABLE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
RBO40-40G 制造商:STMicroelectronics 功能描述:TVS DIODE
RBO40-40G-TR 功能描述:浪涌抑制器 Reversed Battery OverVolt Prot RoHS:否 制造商:Bourns 電壓額定值:40 V 電流額定值:750 mA 工作溫度范圍:- 40 C to + 125 C 端接類(lèi)型:SMD/SMT 封裝 / 箱體:
RBO40-40M 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
RBO40-40T 功能描述:TVS二極管陣列 Batt & Overvolt Prot RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類(lèi)型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C
RBOM 1517 制造商:BRITOOL 功能描述:15X17MM OFFSET RATCHET WR
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