參數(shù)資料
型號(hào): PUMA68S4000/A-45
元件分類: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, QMA68
封裝: PLASTIC, LCC-68
文件頁(yè)數(shù): 9/9頁(yè)
文件大?。?/td> 134K
代理商: PUMA68S4000/A-45
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.4 : December 1999
9
Co Planarity
Specified as +/- 2 thou max.
Visual Inspection Standard
All devices inspected to ANSI/J-STD-001B Class 2 standard
Moisture Sensitivity
Devices are moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220OC) must be :
A : Mounted within 72 Hours at factory conditions of <30OC/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23OC +/-5% devices require baking
as specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125OC +/-5% for high temperature device containers
OR
B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
6OC/sec max.
Temp. exceeding 183OC 150 secs. max.
Peak Temperature
225OC
Time within 5OC of peak 20 secs max.
Ramp down
6OC/sec max.
Vapour Phase -
Ramp up rate
6OC/sec max.
Peak Temperature
215 - 219OC
Time within 5OC of peak 60 secs max.
Ramp down
6OC/sec max.
The above conditions must not be exceeded.
Note : The above recommendations are based on standard industry practice. Failure to comply with
the above recommendations invalidates product warranty.
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