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參數(shù)資料
| 型號： | PUMA68S16000ABM-020 |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PQCC68 |
| 封裝： | PLASTIC, LCC-68 |
| 文件頁數(shù)： | 9/9頁 |
| 文件大?。?/td> | 124K |
| 代理商： | PUMA68S16000ABM-020 |
PUMA 68S16000/AB-020/025/35/45
ISSUE 5.0 : May 2001
9
Moisture Sensitivity
Devices are moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220OC) must be :
A : Mounted within 72 Hours at factory conditions of <30OC/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23OC +/-5% devices require baking
as specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125OC +/-5% for high temperature device containers
OR
B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers.
Packaging Standard
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
6OC/sec max.
Temp. exceeding 183OC 150 secs. max.
Peak Temperature
225OC
Time within 5OC of peak
20 secs max.
Ramp down
6OC/sec max.
Vapour Phase -
Ramp up rate
6OC/sec max.
Peak Temperature
215 - 219OC
Time within 5OC of peak
60 secs max.
Ramp down
6OC/sec max.
Note :
The above recomendations are based on standard industry practice. Failiure to comply with
the above recomendations invalidates product warranty.
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