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參數(shù)資料
| 型號(hào)： | PT2309-S(L) |
| 廠商： | Princeton Technology Corporation |
| 英文描述： | Headphone Driver IC |
| 中文描述： | 耳機(jī)驅(qū)動(dòng)IC |
| 文件頁(yè)數(shù)： | 13/13頁(yè) |
| 文件大?。?/td> | 279K |
| 代理商： | PT2309-S(L) |
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URL:http://www.princeton.com.tw
Fax:886-2-29174598
Tel:886-2-66296288
PT2309 V1.2
- 13 -
August, 2006
Headphone Driver IC
PT2309
Symbol
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
L2
R
R1
h
θ
θ
1
θ
2
Min.
1.35
0.10
1.25
0.31
0.28
0.17
0.17
Typ.
-
-
-
-
-
-
-
Max.
1.75
0.25
1.65
0.51
0.48
0.25
0.23
4.90 BSC.
6.00 BSC.
3.90 BSC.
1.27 BSC.
-
1.04 REF.
0.25 BSC.
-
-
-
-
-
0.40
1.27
0.07
0.07
0.25
0°
5°
0°
-
-
0.50
8°
15°
-
Note:
1.
2.
3.
Dimensioning and tolerancing per ANSI Y 14.5M-1994
Controlling Dimension: MILLIMETERS.
Dimension D does not include mold flash protrusions or gate burrs. Mold flash, protrusions or
gate burrs shall not exceed 0.15 mm (0.006 in) per end. Dimension E1 does not include
interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. D
and E1 dimensions are determined at datum H.
The package top may be smaller than the package bottom. Dimensions D and E1 are
determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs,
gate burrs and interlead flash, but including any mismatch between the top and bottom of the
plastic body.
Datums A & B to be determined at datum H.
N is the number of terminal positions. (N=8)
The dimensions apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip.
Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be
0.10mm total in excess of the “b” dimension at maximum material condition. The dambar cannot
be located on the lower radius of the foot.
This chamfer feature is optional. If it is not present, then a pin 1 identifier must be located within
the index area indicated.
10. Refer to JEDEC MS-012, Variation AA.
JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
4.
5.
6.
7.
8.
9.
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