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| 型號： | PT2309-S(L) |
| 廠商： | Princeton Technology Corporation |
| 英文描述： | Headphone Driver IC |
| 中文描述： | 耳機驅(qū)動IC |
| 文件頁數(shù)： | 10/13頁 |
| 文件大?。?/td> | 279K |
| 代理商： | PT2309-S(L) |
URL:http://www.princeton.com.tw
Fax:886-2-29174598
Tel:886-2-66296288
PT2309 V1.2
- 10 -
August, 2006
Headphone Driver IC
PT2309
Symbol
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
E
E1
e
eA
eB
eC
L
Min.
-
0.015
0.115
0.014
0.014
0.045
0.030
0.008
0.008
0.355
0.005
0.300
0.240
Nom.
-
-
0.130
0.018
0.018
0.060
0.039
0.010
0.010
0.365
-
0.310
0.250
0.100 bsc.
0.300 bsc.
-
-
0.130
Max.
0.210
-
0.195
0.022
0.020
0.070
0.045
0.014
0.011
0.400
0.325
0.280
-
0.430
0.060
0.150
0.000
0.115
Note:
1. Controlling Dimensions: INCHES.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol LIST” in Section 2.2 of Publication No.95.
4. Dimension A, A1 and L are measured with the package seated in JEDEC Seating Plane Gauge
GS-3.
5. D, D1 and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall
not exceed 0.010 inch.
6. E and eA measured with the leads constrained to be perpendicular to data -c- .
7. eB and eC are measured at the lead tips with the leads unconstrained.
8. N is the number of leads (N=8)
9. Pointed or rounded lead tips are preferred to ease insertion.
10. b2 and b3 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not
exceed 0.010 inch (0.25mm)
11. Variation BA has a b3 dimension and is 1/2 lead package.
12. Distance between the leads including dambar protrusions to be 0.005 inch minimum.
13. Datum plane -H- coincident with the bottom of lead, where lead exits the body.
14. Refer to JEDEC MS-001, Variation BA.
JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
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