AMCOM CommunICations,Inc.設(shè)計與生產(chǎn)高可靠性射頻晶體管RF Transistors、放大器Amplifiers、偏置器Bias Tees、射頻開關(guān)Switches、衰減器Attenuators、移相器Phase Shifters、濾波器Band Pass Filters,產(chǎn)品線涵蓋裸芯片、封裝器件和模塊化產(chǎn)品,頻率覆蓋0.01-18GHz,尤其以高功率寬帶放大器為行業(yè)領(lǐng)先。AMCOM射頻晶體管和MMIC功率放大器主要有八種封裝形式,分別是CU\BI\BH\BM\FM\SN\SM\QG 一、CU封裝
AMCOM CU封裝是一種特殊設(shè)計的陶瓷封裝。如下圖1所示,中間一直線和CU/W
法蘭,包裝底部可直流接地或RF ground或有效散熱。
The CU series is in a specially designed ceramic package with straight leads and Cu/W flange in a drop-in mounting style. The flange at the bottom of the package serves simultaneously as DC ground, RF ground and thermal path.
二、BI封裝(BI-G封裝)
AMCOM BI封裝是比較常見的一種陶瓷封裝,中間一條微帶線。如下圖3所示:
The BI series uses a specially designed ceramic package with bent (BI-G) or straight (BI) leads in a drop-in mounting style. The flange at the bottom of the package serves simultaneously as DC ground, RF ground, and thermal path.
三、BH封裝
AMCOM BH封裝與BI封裝的區(qū)別在于中間的微帶線,BH更窄,BI更寬。AMCOM今年BH封裝的產(chǎn)品已全停產(chǎn)。
四、BM封裝與FM封裝
FM就是將BM-R安裝在一個鍍金銅法蘭載體上。除封裝形式不同,其他參數(shù)一致。
The FM-R is the BM-R mounted on a gold plated copper flange carrier. There are two screw holes on the flange to facilitate screwing on to a metal heat sink.
五、SN封裝
AMCOM SN封裝的芯片對應(yīng)的裸芯片后綴是00。如AM08011041WM-SN-R對應(yīng)的裸芯片即AM08011041WM-00-R。SN封裝的芯片需要良好的散熱。
The AM357037WM-SN-R is in a ceramic package with a flange and straight RF and DC leads for drop-in assembly. Because of high DC power dissipation, good heat sinking is required, and the chip MMIC has to be mounted using eutectic soldering directly on a metal ridge.
六、SM封裝
七、QG封裝
QG封裝是塑料封裝,最大的優(yōu)勢是低成本。
除以上介紹的芯片封裝產(chǎn)品,AMCOM還有模塊化產(chǎn)品。詳情請聯(lián)系我.
雷麗芳 女士 (項目銷售工程師)
?深圳市立維創(chuàng)展科技有限公司
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