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參數(shù)資料
型號: PPC5605BCLU48
廠商: Freescale Semiconductor
文件頁數(shù): 48/112頁
文件大小: 0K
描述: MCU 32BIT 768K 48MHZ
標準包裝: 40
系列: MPC56xx Qorivva
核心處理器: e200z0h
芯體尺寸: 32-位
速度: 48MHz
連通性: CAN,I²C,LIN,SCI,SPI
外圍設(shè)備: POR,PWM,WDT
輸入/輸出數(shù): 149
程序存儲器容量: 768KB(768K x 8)
程序存儲器類型: 閃存
EEPROM 大?。?/td> 4K x 16
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 29x10b,5x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 176-LQFP
包裝: 托盤
MPC5607B Microcontroller Data Sheet, Rev. 7
Electrical characteristics
Freescale Semiconductor
40
4.5.3
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:
TJ = TA + (PD x RJA)
Eqn. 1
Where:
TA is the ambient temperature in °C.
RJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PI/O (PD = PINT + PI/O).
PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power.
PI/O represents the power dissipation on input and output pins; user determined.
Most of the time for the applications, PI/O< PINT and may be neglected. On the other hand, PI/O may be significant, if the device
is configured to continuously drive external modules and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273 °C)
Eqn. 2
Therefore, solving equations 1 and 2:
K = PD x (TA + 273 °C) + RJA x PD
2
Eqn. 3
Where:
RJC CC
Thermal resistance,
junction-to-case5
Single-layer board — 1s
100
23
°C/W
144
23
176
23
Four-layer board — 2s2p
100
19.8
144
19.2
176
18.8
1 Thermal characteristics are targets based on simulation.
2 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C.
3 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA
and RthJMA.
4 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package. When Greek letters are not available, the symbols are typed as RthJB.
5 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface
layer. When Greek letters are not available, the symbols are typed as RthJC.
Table 14. LQFP thermal characteristics1 (continued)
Symbol
C
Parameter
Conditions2
Pin count
Value
Unit
Min Typ Max
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PPC5605BCLU64 功能描述:MCU 32BIT 768K 64MHZ RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:MPC56xx Qorivva 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:260 系列:73S12xx 核心處理器:80515 芯體尺寸:8-位 速度:24MHz 連通性:I²C,智能卡,UART/USART,USB 外圍設(shè)備:LED,POR,WDT 輸入/輸出數(shù):9 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-VFQFN 裸露焊盤 包裝:管件
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