參數(shù)資料
型號: PM75CLA120
廠商: Mitsubishi Electric Corporation
英文描述: LEAD FREE 16-BIT LED DRV W/OPEN LED DTC
中文描述: 智能功率模塊
文件頁數(shù): 1/6頁
文件大?。?/td> 95K
代理商: PM75CLA120
Oct. 2003
MITSUBISHI <INTELLIGENT POWER MODULES>
PM75CLA120
FLAT-BASE TYPE
INSULATED PACKAGE
PM75CLA120
FEATURE
a) Adopting new 5th generation IGBT (CSTBT) chip, which
performance is improved by 1
μ
m fine rule process.
For example, typical V
ce
(sat)=1.9V @Tj=125
°
C
b) I adopt the over-temperature conservation by Tj detection of
CSTBT chip, and error output is possible from all each con-
servation upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
3
φ
75A, 1200V Current-sense IGBT type inverter
Monolithic gate drive & protection logic
Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
Acoustic noise-less 11kW/15kW class inverter application
APPLICATION
General purpose inverter, servo drives and other motor controls
PACKAGE OUTLINES
Dimensions in mm
1. VUPC
2. UFO
3. UP
4. VUP1
5. VVPC
6. VFO
7. VP
8. VVP1
9. VWPC
10. WFO
11. WP
12. VWP1
13. VNC
14. VN1
15. NC
16. UN
17. VN
18. WN
19. Fo
Terminal code
106
19.75
3.25
7
16
15.25
2-
φ
5.5
MOUNTING HOLES
6-
φ
6
6-2
3-2
3-2
3-2
B
N
P
U
V
W
10.75
6
19- 0.5
32.75
23
23
23
1
6
3
5
3
3
16
16
120
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PM75CLA120_05 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
PM75CLB060 功能描述:MOD IPM L-SERIES 600V 75A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM75CLB060_05 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
PM75CLB120 功能描述:MOD IPM L-SERIES 1200V 75A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM75CLB120_05 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE