- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄365369 > PM200RSA060 (Mitsubishi Electric Corporation) USING INTELLIGENT POWER MODULES PDF資料下載
參數(shù)資料
| 型號： | PM200RSA060 |
| 廠商： | Mitsubishi Electric Corporation |
| 英文描述： | USING INTELLIGENT POWER MODULES |
| 中文描述： | 用智能功率模塊 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 127K |
| 代理商： | PM200RSA060 |
MITSUBISHI <INTELLIGENT POWER MODULES>
PM200RSE060
FLAT-BASE TYPE
INSULATED PACKAGE
Sep. 2001
NOTES FOR STABLE AND SAFE OPERATION ;
Design the PCB pattern to minimize wiring length between opto-coupler and IPM
’
s input terminal, and also to minimize the
stray capacity between the input and output wirings of opto-coupler.
Quick opto-couplers: TPLH, TPLH
≤
0.8
μ
s. Use High CMR type. The line between opto-coupler and intelligent module
should be shortened as much as possible to minimize the floating capacitance.
Slow switching opto-coupler: recommend to use at CTR = 100 ~ 200%, Input current = 8 ~ 10mA, to work in active.
Use 4 isolated control power supplies (V
D
). Also, care should be taken to minimize the instantaneous voltage charge of the
power supply.
Make inductance of DC bus line as small as possible, and minimize surge voltage using snubber capacitor between P and N
terminal.
Use line noise filter capacitor (ex. 4.7nF) between each input AC line and ground to reject common-mode noise from AC line
and improve noise immunity of the system.
OUT
Si
GND
GND
In
Vcc
U
V
W
B
N
P
M
IF
+
–
: Interface which is the same as the U-phase
OUT
Si
GND
GND
In
Vcc
OUT
Si
GND
GND
In
Vcc
OUT
Si
GND
GND
In
Fo
Vcc
OUT
Si
GND
GND
In
Fo
TEMP
Vcc
OUT
Si
GND
GND
In
Fo
Vcc
VWP1
WP
VWPC
Th
UN
VN
VN1
WN
VNC
Rfo
Fo
VVP1
VP
VVPC
≥
0.1
μ
4.7k
1k
≥
0.1
μ
≥
0.1
μ
20k
20k
20k
≥
10
μ
≥
10
μ
≥
10
μ
20k
≥
10
μ
≥
0.1
μ
VUP1
UP
VUPC
Br
IF
IF
IF
5V
OUT
Si
GND
GND
In
Fo
Vcc
V
D
V
D
V
D
V
D
Fig. 8 Application Example Circuit
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PM200CVA060 | FLAT-BASE TYPE INSULATED PACKAGE |
| PM200CSA060 | FLAT-BASE TYPE INSULATED PACKAGE |
| PM200DSA060 | FLAT-BASE TYPE INSULATED PACKAGE |
| PM200DSA120 | FLAT-BASE TYPE INSULATED PACKAGE |
| PM200DVA120 | FLAT-BASE TYPE INSULATED PACKAGE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PM200RSA060_02 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:MITSUBISHI INTELLIGENT POWER MODULES |
| PM200RSD060 | 功能描述:MOD IPM 7PAC 600V 200A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊 |
| PM200RSE060 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:General purpose inverter, servo drives and other motor controls |
| PM200RSE060_05 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| PM20-100K | 功能描述:固定電感器 10uH 10% RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。