參數(shù)資料
型號: PLUS173BA
廠商: NXP SEMICONDUCTORS
元件分類: PLD
英文描述: Programmable logic arrays 22 】 42 】 10
中文描述: OT PLD, 15 ns, PQCC28
封裝: PLASTIC, LCC-28
文件頁數(shù): 1/8頁
文件大?。?/td> 73K
代理商: PLUS173BA
Philips Semiconductors Programmable Logic Devices
Product specification
PLUS173B/D
Programmable logic arrays
(22
×
42
×
10)
33
October 22, 1993
853–1298 11164
DESCRIPTION
The PLUS173 PLDs are high speed,
combinatorial Programmable Logic Arrays.
The Philips Semiconductors state-of-the-art
Oxide Isolated Bipolar fabrication process is
employed to produce propagation delays as
short as 12ns.
The 24-pin PLUS173 devices have a
programmable AND array and a
programmable OR array. Unlike PAL
devices, 100% product term sharing is
supported. Any of the 32 logic product terms
can be connected to any or all of the 10
output OR gates. Most PAL ICs are limited to
7 AND terms per OR function; the PLUS173
devices can support up to 32 input wide OR
functions.
The polarity of each output is user-
programmable as either Active-High or
Active-Low, thus allowing AND-OR or
AND-NOR logic implementation. This feature
adds an element of design flexibility,
particularly when implementing complex
decoding functions.
The PLUS173 devices are user-
programmable using one of several
commercially available, industry standard
PLD programmers.
FEATURES
I/O propagation delays (worst case)
PLUS173B – 15ns max.
PLUS173D – 12ns max.
Functional superset of 20L10 and most
other 24-pin combinatorial PAL devices
Two programmable arrays
Supports 32 input wide OR functions
12 inputs
10 bi-directional I/O
42 AND gates
32 logic product terms
10 direction control terms
Programmable output polarity
Active-High or Active-Low
Security fuse
3-State outputs
Power dissipation: 750mW (typ.)
TTL Compatible
APPLICATIONS
Random logic
Code converters
Fault detectors
Function generators
Address mapping
Multiplexing
PIN CONFIGURATIONS
1
2
3
4
5
6
7
8
9
10
11
12
I9
13
I10 GND I11
14
15
16
B0 B1 B2
17
18
19
20
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
N Package
I0
I1
I2
I3
I4
I5
I6
I7
I8
I9
I10
V
CC
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
I11
GND
A Package
N = Plastic Dual In-Line (300mil-wide)
I0
I1
I2
I3
V
CC
B9 B8
NC
I4
I5
I6
I7
I8
NC
NC
B3
B7
B6
B5
B4
NC
A = Plastic Leaded Chip Carrier
ORDERING INFORMATION
DESCRIPTION
t
PD
(MAX)
ORDER CODE
DRAWING NUMBER
24-Pin Plastic Dual In-Line 300mil-wide
15ns
PLUS173BN
0410D
24-Pin Plastic Dual In-Line 300mil-wide
12ns
PLUS173DN
0410D
28-Pin Plastic Leaded Chip Carrier
15ns
PLUS173BA
0401F
28-Pin Plastic Leaded Chip Carrier
12ns
PLUS173DA
0401F
PAL is a registered trademark of Advanced Micro Devices Corporation.
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