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| 型號(hào)： | PIC18F65K22-I/MRRSL |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 52/61頁 |
| 文件大小： | 0K |
| 描述： | MCU PIC 32K FLASH MEM XLP 64QFN |
| 產(chǎn)品培訓(xùn)模塊： | 8-bit PIC® Microcontroller Portfolio |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | PIC® XLP™ 18F |
| 核心處理器： | PIC |
| 芯體尺寸： | 8-位 |
| 速度： | 64MHz |
| 連通性： | I²C，LIN，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測(cè)/復(fù)位，LVD，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 53 |
| 程序存儲(chǔ)器容量： | 32KB（16K x 16） |
| 程序存儲(chǔ)器類型： | 閃存 |
| EEPROM 大?。?/td> | 1K x 8 |
| RAM 容量： | 2K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.8 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 16x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 64-VFQFN 裸露焊盤 |
| 包裝： | 托盤 |
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P89V52X2_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 4 May 2009
56 of 57
NXP Semiconductors
P89V52X2
80C51 with 256 B RAM, 192 B data EEPROM
13. Legal information
13.1
Data sheet status
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Denitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2
Denitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
ofce. In case of any inconsistency or conict with the short data sheet, the
full data sheet shall prevail.
13.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specied use without further testing or modication.
Limiting values — Stress above one or more limiting values (as dened in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/prole/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
13.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales ofce addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2]
Product status[3]
Denition
Objective [short] data sheet
Development
This document contains data from the objective specication for product development.
Preliminary [short] data sheet
Qualication
This document contains data from the preliminary specication.
Product [short] data sheet
Production
This document contains the product specication.
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| PIC18F65K22T-E/PT | 制造商:Microchip Technology Inc 功能描述:32KB FLASH, 2KB RAM, 1KB EE, NANOWATT XLP, GP - Tape and Reel 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT 32KB FLASH 64TQFP 制造商:Microchip Technology Inc 功能描述:32kB Flash, 2kB RAM, 1kB EE, nanoWatt XLP, GP, 64 TQFP 10x10x1mm T/R |
| PIC18F65K22T-I/MR | 功能描述:8位微控制器 -MCU 32kB Flash 2kB RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC18F65K22T-I/MRRSL | 功能描述:8位微控制器 -MCU 32KB Flash 2KB RAM nanoWatt XLP GP RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC18F65K22T-I/PT | 功能描述:8位微控制器 -MCU 32kB Flash 2kB RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC18F65K22T-I/PTRSL | 功能描述:8位微控制器 -MCU 32KB Flash 2KB RAM nanoWatt XLP GP RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
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