參數(shù)資料
型號: PIC16F54T-I/SS
廠商: Microchip Technology
文件頁數(shù): 74/88頁
文件大小: 0K
描述: IC MCU FLASH 512X12 20SSOP
產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
標(biāo)準(zhǔn)包裝: 1,600
系列: PIC® 16F
核心處理器: PIC
芯體尺寸: 8-位
速度: 20MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 12
程序存儲器容量: 768B(512 x 12)
程序存儲器類型: 閃存
RAM 容量: 25 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 20-SSOP(0.209",5.30mm 寬)
包裝: 帶卷 (TR)
PIC16F5X
DS41213D-page 74
2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
.100 BSC
Top to Seating Plane
A
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.050
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
.430
NOTE 1
N
12
D
E1
eB
c
E
L
A2
e
b
b1
A1
A
3
Microchip Technology Drawing C04-070B
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