參數(shù)資料
型號(hào)： PIC16F54T-I/SO
廠商： Microchip Technology
文件頁(yè)數(shù)： 72/88頁(yè)
文件大?。?/td> 0K
描述： IC MCU FLASH 512X12 18SOIC
產(chǎn)品培訓(xùn)模塊： Asynchronous Stimulus
標(biāo)準(zhǔn)包裝： 1,100
系列： PIC® 16F
核心處理器： PIC
芯體尺寸： 8-位
速度： 20MHz
外圍設(shè)備： POR，WDT
輸入/輸出數(shù)： 12
程序存儲(chǔ)器容量： 768B（512 x 12）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 25 x 8
電壓 - 電源 (Vcc/Vdd)： 2 V ~ 5.5 V
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 18-SOIC（0.295"，7.50mm 寬）
包裝： 帶卷 (TR)
PIC16F5X
DS41213D-page 72
2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
18
Pitch
e
1.27 BSC
Overall Height
A
–
2.65
Molded Package Thickness
A2
2.05
–
Standoff §
A1
0.10
–
0.30
Overall Width
E
10.30 BSC
Molded Package Width
E1
7.50 BSC
Overall Length
D
11.55 BSC
Chamfer (optional)
h
0.25
–
0.75
Foot Length
L
0.40
–
1.27
Footprint
L1
1.40 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.20
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
NOTE 1
D
N
E
E1
e
b
1 2 3
A
A1
A2
L
L1
h
c
β
φ
α
Microchip Technology Drawing C04-051B
相關(guān)PDF資料
PDF描述
VI-BNF-CU-S CONVERTER MOD DC/DC 72V 200W
MS27505E17B55S CONN RCPT 55POS BOX MNT W/SCKT
VI-BND-CU-S CONVERTER MOD DC/DC 85V 200W
D38999/26ME6PN CONN PLUG 6POS STRAIGHT W/PINS
PIC10F206-E/P IC PIC MCU FLASH 512X12 8DIP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16F570-E/MV 制造商:Microchip Technology Inc 功能描述:28 PIN 3KB FLASH, 64 RAM, 8MHZ INT. 2- OP AMPS - Rail/Tube 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT 3KB FLASH 28UQFN 制造商:Microchip Technology Inc 功能描述:28 Pin 3KB Flash, 64 RAM, 8MHz Int. 2- Op Amps, 28 UQFN 4x4x0.5mm TUBE
PIC16F570-E/SO 制造商:Microchip Technology Inc 功能描述:28 PIN 3KB FLASH, 64 RAM, 8MHZ INT. 2- OP AMPS - Rail/Tube 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT 3KB FLASH 28SOIC 制造商:Microchip Technology Inc 功能描述:28 Pin 3KB Flash, 64 RAM, 8MHz Int. 2- Op Amps, 28 SOIC .300in TUBE
PIC16F570-E/SP 制造商:Microchip Technology Inc 功能描述:28 PIN 3KB FLASH, 64 RAM, 8MHZ INT. 2- OP AMPS - Rail/Tube 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT 3KB FLASH 28SDIP 制造商:Microchip Technology Inc 功能描述:28 Pin 3KB Flash, 64 RAM, 8MHz Int. 2- Op Amps, 28 SPDIP .300in TUBE
PIC16F570-E/SS 制造商:Microchip Technology Inc 功能描述:28 PIN 3KB FLASH, 64 RAM, 8MHZ INT. 2- OP AMPS - Rail/Tube 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT 3KB FLASH 28SSOP 制造商:Microchip Technology Inc 功能描述:28 Pin 3KB Flash, 64 RAM, 8MHz Int. 2- Op Amps, 28 SSOP .209in TUBE
PIC16F570-I/MV 制造商:Microchip Technology Inc 功能描述:28 Pin 3KB Flash, 64 RAM, 8MHz Int. 2- Op Amps 制造商:Microchip Technology Inc 功能描述:28 PIN 3KB FLASH, 64 RAM, 8MHZ INT. 2- OP AMPS - Rail/Tube 制造商:Microchip Technology Inc 功能描述:MCU 8-bit PIC16 PIC RISC 3KB Flash 2.5V/3.3V/5V 28-Pin UQFN EP Tube 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT 3KB FLASH 28UQFN 制造商:Microchip Technology Inc 功能描述:IC 8BIT MCU PIC16 8MHZ UQFN-28 制造商:Microchip Technology Inc 功能描述:IC, 8BIT MCU, PIC16, 8MHZ, UQFN-28 制造商:Microchip Technology Inc 功能描述:PIC16 8-bit Microcontroller with 3K flash in a 28 pin UQFN package 制造商:Microchip Technology Inc 功能描述:28 Pin 3KB Flash, 64 RAM, 8MHz Int. 2- Op Amps, 28 UQFN 4x4x0.5mm TUBE 制造商:Microchip Technology Inc 功能描述:MCU,PIC 8-bit,3KB Flash 64 RAM,UQFN 28
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*