參數(shù)資料
型號(hào)： PIC16F1827-I/ML
廠商： Microchip Technology
文件頁(yè)數(shù)： 107/109頁(yè)
文件大?。?/td> 0K
描述： IC PIC MCU FLASH 4K 28-QFN
產(chǎn)品培訓(xùn)模塊： XLP Deep Sleep Mode
8-bit PIC® Microcontroller Portfolio
特色產(chǎn)品： Extreme Low Power (XLP) Microcontrollers
標(biāo)準(zhǔn)包裝： 61
系列： PIC® XLP™ mTouch™ 16F
核心處理器： PIC
芯體尺寸： 8-位
速度： 32MHz
連通性： I²C，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，POR，PWM，WDT
輸入/輸出數(shù)： 16
程序存儲(chǔ)器容量： 7KB（4K x 14）
程序存儲(chǔ)器類型： 閃存
EEPROM 大?。?/td> 256 x 8
RAM 容量： 384 x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 12x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 28-VQFN 裸露焊盤
包裝： 托盤
產(chǎn)品目錄頁(yè)面： 655 (CN2011-ZH PDF)
2011 Microchip Technology Inc.
DS41391D-page 7
PIC16(L)F1826/27
Table of Contents
1.0
Device Overview .......................................................................................................................................................................... 9
2.0
Enhanced Mid-Range CPU ........................................................................................................................................................ 15
3.0
Memory Organization ................................................................................................................................................................. 17
4.0
Device Configuration .................................................................................................................................................................. 43
5.0
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 51
6.0
Reference Clock Module ............................................................................................................................................................ 69
7.0
Resets ........................................................................................................................................................................................ 73
8.0
Interrupts .................................................................................................................................................................................... 81
9.0
Power-Down Mode (Sleep) ........................................................................................................................................................ 95
10.0 Watchdog Timer (WDT) ............................................................................................................................................................. 97
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 101
12.0 I/O Ports ................................................................................................................................................................................... 117
13.0 Interrupt-on-Change ................................................................................................................................................................. 131
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 135
15.0 Temperature Indicator .............................................................................................................................................................. 137
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 139
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 153
18.0 SR Latch................................................................................................................................................................................... 157
19.0 Comparator Module.................................................................................................................................................................. 163
20.0 Timer0 Module ......................................................................................................................................................................... 173
21.0 Timer1 Module ......................................................................................................................................................................... 177
22.0 Timer2/4/6 Modules.................................................................................................................................................................. 191
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 193
24.0 Capture/Compare/PWM (ECCP1, ECCP2, ECCP3, CCP4) Modules ..................................................................................... 203
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 231
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 285
27.0 Capacitive Sensing Module...................................................................................................................................................... 315
28.0 In-Circuit Serial Programming (ICSP) ................................................................................................................................ 321
29.0 Instruction Set Summary .......................................................................................................................................................... 325
30.0 Electrical Specifications............................................................................................................................................................ 339
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 371
32.0 Development Support............................................................................................................................................................... 379
33.0 Packaging Information.............................................................................................................................................................. 383
Appendix A: Revision History............................................................................................................................................................. 393
Appendix B: Device Differences ........................................................................................................................................................ 393
Index .................................................................................................................................................................................................. 395
The Microchip Web Site..................................................................................................................................................................... 403
Customer Change Notification Service .............................................................................................................................................. 403
Customer Support.............................................................................................................................................................................. 403
Reader Response .............................................................................................................................................................................. 404
Product Identification System ............................................................................................................................................................ 405
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16F1827T-I/ML 功能描述:8位微控制器 -MCU 7KB Flash 384 byte 32 MHz Int. Osc RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1827T-I/MQ 功能描述:8位微控制器 -MCU 7KB Flash 384 byte 32 MHz Int. Osc RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1827T-I/MV 功能描述:8位微控制器 -MCU 7KB Flash 384 RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1827T-I/SO 功能描述:8位微控制器 -MCU 7KB Flash 384 byte 32 MHz Int. Osc RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1827T-I/SS 功能描述:8位微控制器 -MCU 7KB Flash 384 byte 32 MHz Int. Osc RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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