參數(shù)資料
型號(hào)： PIC12F1822T-I/MF
廠商： Microchip Technology
文件頁(yè)數(shù)： 102/109頁(yè)
文件大小： 0K
描述： MCU 8BIT 2K FLASH 8DFN
標(biāo)準(zhǔn)包裝： 3,300
系列： PIC® XLP™ 12F
核心處理器： PIC
芯體尺寸： 8-位
速度： 32MHz
連通性： I²C，LIN，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，POR，PWM，WDT
輸入/輸出數(shù)： 6
程序存儲(chǔ)器容量： 3.5KB（2K x 14）
程序存儲(chǔ)器類型： 閃存
EEPROM 大小： 256 x 8
RAM 容量： 128 x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 4x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 8-VDFN 裸露焊盤
包裝： 帶卷 (TR)
Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 05 — 10 May 2004
52 of 55
9397 750 13132
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex
foil by using a hot bar soldering process. The appropriate soldering prole can be provided on
request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
相關(guān)PDF資料
PDF描述
D38999/26JJ29HA CONN PLUG 29POS STRAIGHT W/PINS
VE-BN2-IW-F4 CONVERTER MOD DC/DC 15V 100W
PIC16HV616T-I/ML IC PIC MCU FLASH 2KX14 16QFN
PIC12LF1501-E/SN IC MCU 8BIT 1.75KB FLASH 8SOIC
PIC16LF721-E/SS MCU PIC 3.5KB FLASH 20SSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC12F1840 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8-Pin Flash Microcontrollers with nanoWatt XLP Technology
PIC12F1840-E/MF 功能描述:8位微控制器 -MCU 7KB Flash EEPROM 256b nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC12F1840-E/MF 制造商:Microchip Technology Inc 功能描述:; Controller Family/Series:PIC12F; Core
PIC12F1840-E/P 功能描述:8位微控制器 -MCU 7KB Flash EEPROM 256b nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC12F1840-E/P 制造商:Microchip Technology Inc 功能描述:; Controller Family/Series:PIC12F; Core 制造商:Microchip Technology Inc 功能描述:IC MCU, PIC12F, 32MHz, 8-DIP
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*