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參數資料
| 型號： | PIC12F1822T-I/MF |
| 廠商： | Microchip Technology |
| 文件頁數： | 100/109頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU 8BIT 2K FLASH 8DFN |
| 標準包裝： | 3,300 |
| 系列： | PIC® XLP™ 12F |
| 核心處理器： | PIC |
| 芯體尺寸： | 8-位 |
| 速度： | 32MHz |
| 連通性： | I²C，LIN，SPI，UART/USART |
| 外圍設備： | 欠壓檢測/復位，POR，PWM，WDT |
| 輸入/輸出數： | 6 |
| 程序存儲器容量： | 3.5KB（2K x 14） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大小： | 256 x 8 |
| RAM 容量： | 128 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.8 V ~ 5.5 V |
| 數據轉換器： | A/D 4x10b |
| 振蕩器型： | 內部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 8-VDFN 裸露焊盤 |
| 包裝： | 帶卷 (TR) |
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Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 05 — 10 May 2004
50 of 55
9397 750 13132
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
12. Soldering
12.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne
pitch SMDs. In these situations reow soldering is recommended. In these situations
reow soldering is recommended.
12.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 240
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
12.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| PIC12F1840 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8-Pin Flash Microcontrollers with nanoWatt XLP Technology |
| PIC12F1840-E/MF | 功能描述:8位微控制器 -MCU 7KB Flash EEPROM 256b nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數據總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數據 RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
| PIC12F1840-E/MF | 制造商:Microchip Technology Inc 功能描述:; Controller Family/Series:PIC12F; Core |
| PIC12F1840-E/P | 功能描述:8位微控制器 -MCU 7KB Flash EEPROM 256b nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數據總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數據 RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
| PIC12F1840-E/P | 制造商:Microchip Technology Inc 功能描述:; Controller Family/Series:PIC12F; Core 制造商:Microchip Technology Inc 功能描述:IC MCU, PIC12F, 32MHz, 8-DIP |
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