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參數(shù)資料
| 型號： | PE3236-21 |
| 廠商： | PEREGRINE SEMICONDUCTOR CORP |
| 元件分類： | PLL合成/DDS/VCOs |
| 英文描述： | PHASE LOCKED LOOP, PQCC44 |
| 封裝： | PLASTIC, LCC-44 |
| 文件頁數(shù)： | 5/15頁 |
| 文件大?。?/td> | 456K |
| 代理商： | PE3236-21 |
Product Specification
PE3236
Page 13 of 15
Document No. 70-0026-04
│ www.psemi.com
2003-2010 Peregrine Semiconductor Corp. All rights reserved.
Handling Requirements
All surface mount products which do not meet
Level 1 moisture sensitivity requirements are
processed through dry bake and pack procedure.
The necessary data is recorded on the caution
label of each shipment. The 44-lead PLCC
package is moisture sensitivity Level 3.
Level 3 Caution Label
The caution label should contain the following
information for Level 3 devices:
1. Calculated shelf life in sealed bag: 12 months
at <40 °C and <90% relative humidity (RH)
2. Peak package body temperature is 225 °C.
3. After bag is opened, devices that will be
subjected to reflow solder or other high
temperature process must
a) Be mounted within 168 hours of factory
conditions <30 °C/60% RH, or
b) Be stored at <10% RH
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card is > 10% when
read at 23 ± 5 °C
b) 3a or 3b are not met
5. If baking is required, devices may be baked for
48 hours at 125 +5/-0 °C
Note: If device containers cannot be subjected to
high temperature or shorter bake times are
desired, reference IPC/JEDEC-J-STD-033 for
bake procedure.
Level and Body temperature defined by:
IPC/JEDEC-J-STD-020
For Dry Bake Procedures, see:
IPC/JEDEC-J-STD-033
Operator must observe ESD precautions per
ESD Control Procedure and Parts Handling and
shipping Procedure.
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相關(guān)代理商/技術(shù)參數(shù) |
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