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參數(shù)資料
| 型號： | PCF8591T-T |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO16 |
| 封裝： | 7.50 MM, PLASTIC, SOT162-1, SO-16 |
| 文件頁數(shù)： | 16/28頁 |
| 文件大小： | 139K |
| 代理商： | PCF8591T-T |
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2003 Jan 27
23
Philips Semiconductors
Product specication
8-bit A/D and D/A converter
PCF8591
17 SOLDERING
17.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our
“Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
17.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
17.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°C, contact may be up to 5 seconds.
17.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable(1)
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| PCF8593 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low power clock/calendar |
| PCF8593P | 制造商:NXP Semiconductors 功能描述:Clock/Calendar/Alarm/Timer/Interrupt Serial (I2C) Bulk 制造商:NXP Semiconductors 功能描述:IC RTC/CALENDAR 8593 DIP8 制造商:NXP Semiconductors 功能描述:IC, RTC/CALENDAR, 8593, DIP8 制造商:NXP Semiconductors 功能描述:IC, RTC/CALENDAR, 8593, DIP8; Date Format:DD:MM:YYYY; Clock Format:HH:MM:SS; Clock IC Type:Clock, Calendar; Supply Voltage Min:1V; Supply Voltage Max:6V; Digital IC Case Style:DIP; No. of Pins:8; Interface Type:I2C; Operating ;RoHS Compliant: Yes |
| PCF8593P,112 | 功能描述:實時時鐘 CLOCK/CALENDAR LOW PWR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| PCF8593P112 | 制造商:NXP Semiconductors 功能描述:IC RTC YY-MM-DD-dd DIP-8 制造商:NXP Semiconductors 功能描述:IC RTC/CALENDAR 8593 DIP8 |
| PCF8593T | 制造商:PHILIPS-SEMI 功能描述: 制造商:NXP Semiconductors 功能描述:Real Time Clock, 8 Pin, Plastic, SOP |
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