參數(shù)資料
型號(hào)： PCF2113AU10
廠(chǎng)商： NXP Semiconductors N.V.
英文描述： RECTIFIER SBR DUAL 20A 60V 180A-ifsm 650mV-vf 0.5mA-ir TO-220AB 50/TUBE
中文描述： LCD控制器/驅(qū)動(dòng)器
文件頁(yè)數(shù)： 65/72頁(yè)
文件大?。?/td> 332K
代理商： PCF2113AU10
2001 Dec 19
65
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
20 SOLDERING
20.1
Introduction to soldering surface mount
packages
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitisnotsuitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.
20.2
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
°
C. The top-surface temperature of the
packages should preferable be kept below 220
°
C for
thick/large packages, and below 235
°
C for small/thin
packages.
20.3
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
20.4
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°
C.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCF2113AUF4 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:LCD controllers/drivers
PCF2113D 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:LCD controller/driver
PCF2113DH 制造商:NXP Semiconductors 功能描述:18 X 60 DOTS DOT MAT LCD DRVR AND DSPL CTLR, PQFP100
PCF2113DH/4 功能描述:LCD 驅(qū)動(dòng)器 I2C LCD CHARCTR DRVR RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時(shí)鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube
PCF2113DH/4,557 功能描述:LCD 驅(qū)動(dòng)器 I2C LCD CHARCTR DRVR RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時(shí)鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube
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