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參數(shù)資料
型號(hào): PCA9555N,112
廠商: NXP Semiconductors
文件頁數(shù): 24/34頁
文件大?。?/td> 0K
描述: IC I/O EXPANDER I2C 16B 24DIP
產(chǎn)品培訓(xùn)模塊: I²C Bus Fundamentals
特色產(chǎn)品: NXP - I2C Interface
標(biāo)準(zhǔn)包裝: 15
接口: I²C,SM 總線
輸入/輸出數(shù): 16
中斷輸出:
頻率 - 時(shí)鐘: 400kHz
電源電壓: 2.3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 通孔
封裝/外殼: 24-DIP(0.600",15.24mm)
供應(yīng)商設(shè)備封裝: 24-DIP
包裝: 管件
包括: POR
產(chǎn)品目錄頁面: 826 (CN2011-ZH PDF)
配用: 568-4002-ND - DEMO BOARD I2C
其它名稱: 568-2027-5
935276768112
PCA9555N
PCA9555_8
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
30 of 34
NXP Semiconductors
PCA9555
16-bit I2C-bus and SMBus I/O port with interrupt
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
16. Soldering of through-hole mount packages
16.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 32. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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