參數(shù)資料
型號(hào)： PCA9513A
廠商： NXP Semiconductors N.V.
英文描述： Hot swappable I2C-bus and SMBus bus buffer
中文描述： 熱插拔I2C總線和SMBus總線緩沖器
文件頁(yè)數(shù)： 23/25頁(yè)
文件大小： 142K
代理商： PCA9513A
PCA9513A_PCA9514A_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 October 2005
23 of 25
Philips Semiconductors
PCA9513A; PCA9514A
Hot swappable I
2
C-bus and SMBus bus buffer
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. Revision history
Table 7:
Acronym
AdvancedTCA
CDM
cPCI
ESD
HBM
I
2
C-bus
MM
PCI
PICMG
SMBus
VME
Abbreviations
Description
Advanced Telecommunications Computing Architecture
Charged Device Model
compact Peripheral Component Interface
ElectroStatic Discharge
Human Body Model
Inter IC bus
Machine Model
Peripheral Component Interface
PCI Industrial Computer Manufacturers Group
System Management Bus
VERSAModule Eurocard
Table 8:
Document ID
Revision history
Release
date
20051011
Data sheet status
Change
notice
-
Doc. number
Supersedes
PCA9513A_PCA9514A_1
Product data sheet
-
-
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PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9513AD 功能描述:緩沖器和線路驅(qū)動(dòng)器 HOT SWAP I2C/SMBUS BUS BUFFER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
PCA9513AD,112 功能描述:緩沖器和線路驅(qū)動(dòng)器 HOT SWAP I2C/SMBUS RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
PCA9513AD,118 功能描述:緩沖器和線路驅(qū)動(dòng)器 HOT SWAP I2C/SMBUS RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
PCA9513AD112 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
PCA9513ADP 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Hot swappable I2C-bus and SMBus bus buffer
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