參數(shù)資料
型號: PC755BVZFU350LD
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 360PIN |塑料
文件頁數(shù): 7/48頁
文件大?。?/td> 276K
代理商: PC755BVZFU350LD
PC755B/745B
7/48
2. PIN ASSIGNEMENTS
Figure 2 (in part A) shows the pinout of the PC745B, 255PBGA package as viewed from the top surface. Part B shows the side profile
of the PBGA package to indicate the direction of the top surface view.
Part A
Pinout of the PC745B, 255 PBGA Package as Viewed from the Top Surface
1 2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Not to Scale
View
Die
Substrate Assembly
Encapsulant
Part B
Figure 2 : Pinout of the PC745B, 255 PBGA Package as Viewed from the Top Surface
相關(guān)PDF資料
PDF描述
PC745 PC755/745 Preliminary [Updated 06/03. 50 Pages]
PC745BMZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC755BVZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC745BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BMZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
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