參數(shù)資料
型號(hào)： PC755
廠商： Atmel Corp.
英文描述： PowerPC 755/745 RISC Microprocessor
中文描述： RISC微處理器PowerPC的745分之755
文件頁(yè)數(shù)： 21/50頁(yè)
文件大?。?/td> 1064K
代理商： PC755
21
PC755/745
2138D–HIREL–06/03
θ
jc
is the junction-to-case thermal resistance
θ
int
is the adhesive or interface material thermal resistance
θ
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation the die-junction temperatures (T
j
) should be maintained less than the
value specified in Table 5. The temperature of the air cooling the component greatly
depends upon the ambient inlet air temperature and the air temperature rise within the
electronic cabinet. An electronic cabinet inlet-air temperature (T
a
) may range from 30 to
40
°
C. The air temperature rise within a cabinet (T
r
) may be in the range of 5 to 10
°
C.
The thermal resistance of the thermal interface material (
θ
int
) is typically about 1
°
C/W.
Assuming a T
a
of 30
°
C, a T
r
of 5
tion (P
d
) of 5.0 watts, the following expression for T
j
is obtained:
Die-junction temperature: T
j
= 30
°
C + 5
°
C + (0.03
°
C/W + 1.0
°
C/W +
θ
sa
) * 5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa
)
versus airflow velocity is shown in Figure 9.
o
C, a CBGA package
θ
jc
= 0.03, and a power consump-
Figure 9.
Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Air-
flow Velocity
8
Assuming an air velocity of 0.5 m/s, we have an effective R
sa
of 7
°
C/W, thus
T
j
= 30
°
C+ 5
°
C+ (0.03
°
C/W +1.0
°
C/W + 7
°
C/W) * 5.0 W,
resulting in a die-junction temperature of approximately 81
°
C which is well within the
maximum operating temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakefield Engineering,
and Aavid Engineering offer different heat sink-to-ambient thermal resistances, and may
or may not need air flow.
1
3
5
7
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin±fin Heat Sink
(25 x28 x 15 mm)
Approach Air Velocity (m/s)
2
4
6
H
相關(guān)PDF資料
PDF描述
PC755M8 PC755M8 [Updated 6/03. 35 Pages] 32-bit RISC PowerPC-based Multichip Module
PC755CMGHU300LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU350LE PowerPC 755/745 RISC Microprocessor
PC755CMGHU366LE PowerPC 755/745 RISC Microprocessor
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC755BMGH300LE 制造商:e2v technologies 功能描述:POWERPC 755 32-BIT RISC MICROPROCESSOR - 300MHZ, 2.0V, HITCE, MIL TEMP 制造商:e2v technologies 功能描述:PC755BMGH300LE - Trays
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