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PC755B/745B
B.DETAILED SPECIFICATION
1. SCOPE
This drawing describes the specific requirements for the microprocessor PC755B, in compliance with ATMEL Grenoble standard
screening.
2. APPLICABLE DOCUMENTS
1) MIL-STD-883 : Test methods and procedures for electronics.
2) MIL-PRF-38535 appendix A : General specifications for microcircuits.
3. REQUIREMENTS
3.1. General
The microcircuits are in accordance with the applicable documents and as specified herein.
3.2. Design and construction
3.2.1. Terminal connections
Depending on the package, the terminal connections is shown in table 1, table 2 and Figure 4.
3.2.2. Absolute maximum rating
Table 3. Absolute Maximum Ratings
Characteristic
Symbol
Maximum Value
Unit
Note
Core supply voltage
Vdd
–0.3 to 2.5
V
4
PLL supply voltage
AVdd
–0.3 to 2.5
V
4
L2 DLL supply voltage
L2AVdd
–0.3 to 2.5
V
4
Processor bus supply voltage
OVdd
–0.3 to 3.465
V
3
L2 bus supply voltage
L2OVdd
–0.3 to 3.465
V
3
Input voltage
Processor bus
V
in
–0.3 to OVdd + 0.3V
V
2,5
L2 Bus
V
in
–0.3 to L2OVdd + 0.3V
V
2,5
JTAG Signals
V
in
–0.3 to 3.6
V
Storage temperature range
T
stg
–55 to 150
o
C
Notes:
1. Functional and tested operating conditions are given in Table 4. Absolute maximum ratings are stress ratings only,
and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliabil-
ity or cause permanent damage to the device.
2. Caution: Vin must not exceed OVdd or L2OVdd by more than 0.3V at any time including during power-on reset.
3. Caution: L2OVdd/OVdd must not exceed Vdd/AVdd/L2AVdd by more than 1.2V at any time including during pow-
er-on reset.
4. Caution: Vdd/AVdd/L2AVdd must not exceed L2OVdd/OVdd by more than 0.4V at any time including during pow-
er-on reset.
5. V
in
may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.