參數(shù)資料
型號: PC745
英文描述: PC755/745 Preliminary [Updated 06/03. 50 Pages]
中文描述: PC755/745初步[更新06/03。 50頁]
文件頁數(shù): 8/48頁
文件大?。?/td> 276K
代理商: PC745
8/48
PC755B/745B
Figure 3 (in part A) shows the pinout of the PC755B, 360 PBGA packages as viewed from the top surface. Part B shows the side
profile of the PBGA package to indicate the direction of the top surface view.
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1 2
3
4
5
6
7 8
9
10 11 12 13 14 15 16
Not to Scale
17 18 19
View
Die
Substrate Assembly
Encapsulant
Part B
Figure 3 : Pinout of the PC755B, 360 PBGA Packages as Viewed from the Top Surface
相關PDF資料
PDF描述
PC745BMZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC755BVZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC745BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BMZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
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