參數(shù)資料
型號(hào): PC745
英文描述: PC755/745 Preliminary [Updated 06/03. 50 Pages]
中文描述: PC755/745初步[更新06/03。 50頁(yè)]
文件頁(yè)數(shù): 38/48頁(yè)
文件大?。?/td> 276K
代理商: PC745
38/48
PC755B/745B
7. PACKAGE MECHANICAL DATA
The following sections provide the package parameters and mechanical dimensions for the PC745B, 255 PBGA package as well as
the PC755B, 360 CBGA and PBGA packages. While both the PC755B plastic and the ceramic packages are described here, both
packages are not guaranteed to be available at the same time. All new designs should allow for either ceramic or plastic BGA pack-
ages for this device. For more information on designing a common footprint for both plastic and ceramic package types, please con-
tact your local Motorola sales office.
7.1. Parameters for the PC745B
7.1.1. Package Parameters for the PC745B PBGA
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-lead plastic ball grid
array (PBGA)
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array - 1
Pitch
1.27 mm (50 mil)
Minimum module height
2.25 mm
Maximum module height
2.80 mm
Ball diameter (typical)
0.75 mm (29.5 mil)
相關(guān)PDF資料
PDF描述
PC745BMZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC755BVZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC745BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BMZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC7457 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7457MGH933NC 制造商:e2v technologies 功能描述:MPU MPC74XX RISC 64BIT 0.13UM 933MHZ 1.5V/1.8V/2.5V 483HITCE - Trays
PC7457MGU1000L 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7457MGU1000N 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7457MGU1200L 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor