參數(shù)資料
型號: PC7410VGU500N
廠商: Atmel Corp.
英文描述: PowerPC 7410 RISC Microprocessor Product Specification
中文描述: 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格
文件頁數(shù): 16/54頁
文件大?。?/td> 692K
代理商: PC7410VGU500N
16
PC7410
2141D–HIREL–02/04
Figure 7.
Thermalloy #2328B Heat Sink-to-ambient Thermal Resistance vs. Airflow
Velocity
Assuming an air velocity of 0.5 m/s, the effective R
sa
is 7
°
C/W, thus
30
°
C
5
°
C
0,03
°
C W
1,0
°
C W
+
(
+
+
=
,
resulting in a die-junction temperature of approximately 75
°
C which is well within the
maximum operating temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakefield Engineering and
Aavid Engineering offer different heat sink-to-ambient thermal resistances and may or
may not need air flow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances
are a common figure of merit used for comparing the thermal performance of various
microelectronic packaging technologies, one should exercise caution when only using
this metric in determining thermal management because no single parameter can ade-
quately describe three-dimensional heat flow. The final die-junction operating
temperature is not only a function of the component-level thermal resistance, but of the
system-level design and its operating conditions. In addition to the component's power
consumption, a number of factors affect the final operating die-junction temperature –
airflow, board population (local heat flux of adjacent components), heat sink efficiency,
heat sink attach, heat sink placement, next-level interconnect technology, system air
temperature rise, altitude, etc.
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-Fin Heat Sink
(25 x 28 x 15 mm)
Approach Air Velocity (m/s)
H
2
4
6
T
j
7
°
C W
+
)
5
W
×
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