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參數(shù)資料
| 型號： | PC7410VGU500N |
| 廠商： | Atmel Corp. |
| 英文描述： | PowerPC 7410 RISC Microprocessor Product Specification |
| 中文描述： | 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格 |
| 文件頁數(shù)： | 14/54頁 |
| 文件大?。?/td> | 692K |
| 代理商： | PC7410VGU500N |
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14
PC7410
2141D–HIREL–02/04
Adhesives and Thermal
Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to
minimize the thermal contact resistance. For those applications where the heat sink is
attached by spring clip mechanism, Figure 6 shows the thermal performance of three
thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint
and a joint with thermal grease as a function of contact pressure. As shown, the perfor-
mance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. That is,
the bare joint results in a thermal resistance approximately seven times greater than the
thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-
circuit board (see Figure 5). This spring force should not exceed 5.5 pounds of force.
Therefore, synthetic grease offers the best thermal performance, considering the low
interface pressure.
The board designer can choose between several types of thermal interface. Heat sink
adhesive materials should be selected based upon high conductivity, yet must have
adequate mechanical strength to meet equipment shock/vibration requirements.
Figure 6.
Thermal Performance of Different Thermal Interface Materials
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Silicone Sheet (0.006")
Bare Joint
Floroether Oil Sheet (0.007")
Graphite/Oil Sheet (0.005")
Synthetic Grease
Contact Pressure (psi)
S
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PC7410MGU450L | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410MGSU450L | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410MGSU500L | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410MGSU500N | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7447 | PowerPC 7457 RISC Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC7447 | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor |
| PC7447A | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC RISC microprocessor |
| PC7447AMGH1000LB | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC RISC microprocessor |
| PC7447AMGH1000NB | 制造商:e2v Aerospace & Defense 功能描述:MPU RISC 32-Bit 0.13um 1GHz 1.8V/2.5V 360-Pin HITCE CBGA 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.13UM 1GHZ 1.8V/2.5V 360HITCE CBGA - Trays |
| PC7447AMGH1000ZH4 | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.13UM 1GHZ 1.8V/2.5V - Bulk |
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