參數(shù)資料
型號： PC7410VGSU400N
廠商： Atmel Corp.
英文描述： PowerPC 7410 RISC Microprocessor Product Specification
中文描述： 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格
文件頁數(shù)： 12/54頁
文件大?。?/td> 692K
代理商： PC7410VGSU400N
12
PC7410
2141D–HIREL–02/04
Thermal Characteristics
Package Characteristics
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-
ture, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. The actual value of R
θ
JC
for the part is less than 0.1°C/W.
See
“Thermal Management Information” on page 13
for more details about thermal management.
The board designer can choose between several commercially available heat sink types to place on the PC7410. For
exposed-die packaging technology as in Table 5, the intrinsic conduction thermal resistance paths are shown in Figure 4.
Package Thermal
Characteristics for HiTCE
Table 6 provides the package thermal characteristics for the PC7410, HiTCE.
Notes:
1. Simulation, no convection air flow.
2. Per JEDEC JESD51-6 with the board horizontal.
Package Thermal
Characteristics for CI-CGA
Table 5.
Package Thermal Characteristics CBGA
Symbol
Characteristic
Value
PC7410 CBGA
Unit
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
(1)(2)
24
°
C/W
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
(1)(3)
17
°
C/W
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
(1)(3)
18
°
C/W
Junction-to-ambient thermal resistance, 400 ft/min airflow, single-layer (1s) board
16
°
C/W
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
(1)(3)
14
°
C/W
Junction-to-ambient thermal resistance, 400 ft/min airflow, four-layer (2s2p) board
13
°
C/W
Junction-to-board thermal resistance
(4)
8
°
C/W
Junction-to-case thermal resistance
(5)
< 0.1
°
C/W
Table 6.
Package Thermal Characteristics for HiTCE Package
Characteristic
Symbol
Value
Unit
°
C/W
°
C/W
PC7410 HiTCE
Junction-to-bottom of balls
(1)
R
θ
J
R
θ
JMA
6.8
Junction-to-ambient thermal resistance,
natural convection, four-layer (2s2p) board
(1)(2)
20.7
Junction to board thermal resistance
R
θ
JB
11.0
°
C/W
Table 7.
Package Thermal Characteristics for CI-CGA
Characteristic
Symbol
Value
Unit
°
C/W
PC7410 CI-CGA
Junction to board thermal resistance
R
θ
JB
8.42
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