參數(shù)資料
型號： PC7410MGSU500N
廠商： Atmel Corp.
英文描述： PowerPC 7410 RISC Microprocessor Product Specification
中文描述： 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格
文件頁數(shù)： 51/54頁
文件大小： 692K
代理商： PC7410MGSU500N
i
PC7410
2141D–HIREL–02/04
Table of Contents
Features ................................................................................................1
Description........................................................................................... 1
Screening .............................................................................................2
Block Diagram ......................................................................................3
General Parameters............................................................................. 4
Features ................................................................................................4
Signal Description ............................................................................... 8
Detailed Specification .........................................................................9
Scope ....................................................................................................9
Applicable Documents ........................................................................9
Requirements .......................................................................................9
General .................................................................................................................9
Design and Construction ......................................................................................9
Terminal Connections................................................................................... 9
Absolute Maximum Ratings.................................................................................. 9
Recommended Operating Conditions .................................................................11
Thermal Characteristics ......................................................................................12
Package Characteristics .............................................................................12
Internal Package Conduction Resistance................................................... 13
Thermal Management Information ..............................................................13
Adhesives and Thermal Interface Materials ................................................14
Power Consideration .......................................................................................... 17
Power Management.....................................................................................17
Power Dissipation .......................................................................................18
Electrical Characteristics.................................................................. 19
Static Characteristics.......................................................................................... 19
Dynamic Characteristics..................................................................................... 20
Clock AC Specifications ..............................................................................20
Processor Bus AC Specifications ............................................................... 21
L2 Clock AC Specifications .........................................................................23
L2 Bus AC Specifications ............................................................................26
IEEE 1149.1 AC Timing Specifications....................................................... 28
Preparation for Delivery.................................................................... 30
Handling .............................................................................................30
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